Yan, Z., Kang, T., Zhang, W., & Wang, J. Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration. Wiley.
Chicago Style (17th ed.) CitationYan, Zhaowen, Ting Kang, Wei Zhang, and Jianwei Wang. Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration. Wiley.
MLA (9th ed.) CitationYan, Zhaowen, et al. Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration. Wiley.
Warning: These citations may not always be 100% accurate.