Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads

The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board lev...

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Main Authors: P.F. Fuchs, Z. Major
Format: Article
Language:English
Published: Gruppo Italiano Frattura 2013-04-01
Series:Fracture and Structural Integrity
Online Access:https://www.fracturae.com/index.php/fis/article/view/109
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author P.F. Fuchs
Z. Major
author_facet P.F. Fuchs
Z. Major
author_sort P.F. Fuchs
collection DOAJ
description The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board level drop test. In this test, the boards are dropped under defined conditions until a failure in the board is detected. The main failure driver is a flexural oscillation of the board due to the impact event. As this test method has a number of drawbacks, an alternative test method was evaluated in this study. A board level cyclic bend test was used and the results of both tests were compared. A very good correlation between the methods could be observed, supporting the suitability of the board level cyclic bend test for the determination of the drop test performance. The advantages of the alternative test method were shorter testing times, better adaptability and test simulations at lower computing time. In future analysis, test simulations will be used to generate Wöhler curves related to the local stresses.
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institution Kabale University
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publishDate 2013-04-01
publisher Gruppo Italiano Frattura
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series Fracture and Structural Integrity
spelling doaj-art-e2bb11242fbd4ff9a5c2763c2a8f19f62025-02-03T10:40:13ZengGruppo Italiano FratturaFracture and Structural Integrity1971-89932013-04-0151510.3221/IGF-ESIS.15.07Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loadsP.F. FuchsZ. MajorThe reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board level drop test. In this test, the boards are dropped under defined conditions until a failure in the board is detected. The main failure driver is a flexural oscillation of the board due to the impact event. As this test method has a number of drawbacks, an alternative test method was evaluated in this study. A board level cyclic bend test was used and the results of both tests were compared. A very good correlation between the methods could be observed, supporting the suitability of the board level cyclic bend test for the determination of the drop test performance. The advantages of the alternative test method were shorter testing times, better adaptability and test simulations at lower computing time. In future analysis, test simulations will be used to generate Wöhler curves related to the local stresses.https://www.fracturae.com/index.php/fis/article/view/109
spellingShingle P.F. Fuchs
Z. Major
Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
Fracture and Structural Integrity
title Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
title_full Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
title_fullStr Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
title_full_unstemmed Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
title_short Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
title_sort cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
url https://www.fracturae.com/index.php/fis/article/view/109
work_keys_str_mv AT pffuchs cyclicbendtestsforthereliabilityevaluationofprintedcircuitboardsunderdynamicloads
AT zmajor cyclicbendtestsforthereliabilityevaluationofprintedcircuitboardsunderdynamicloads