Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm
This study presents a novel approach aimed at determining optimal parameters for minimizing peeling stress in asymmetric single-lap adhesive joints. Normal and shear stress distributions within this joint configuration are derived analytically through two-dimensional elasticity equations, demonstrat...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Bilijipub publisher
2024-06-01
|
| Series: | Advances in Engineering and Intelligence Systems |
| Subjects: | |
| Online Access: | https://aeis.bilijipub.com/article_199132_d042e10f484aa825268e5cbab33570ac.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1823856465747640320 |
|---|---|
| author | Damilare Adewunmi Chisom Samuel Antonio Fontana |
| author_facet | Damilare Adewunmi Chisom Samuel Antonio Fontana |
| author_sort | Damilare Adewunmi |
| collection | DOAJ |
| description | This study presents a novel approach aimed at determining optimal parameters for minimizing peeling stress in asymmetric single-lap adhesive joints. Normal and shear stress distributions within this joint configuration are derived analytically through two-dimensional elasticity equations, demonstrating the accuracy of the analytical approach through comparison with finite element model. Peeling stress reduction is achieved through application of the Firefly optimization algorithm, where independent variables include the thicknesses of the adhesive and adherends layers. Under tensile loading conditions, the composite joint is analyzed assuming isotropic and linear elastic behavior of the adhesive and adherends layers. Findings indicate a significant reduction in peeling stress of approximately 31% with an optimal thickness ratio of 2.44 for adhesive. Moreover, an increase in the ratio of Young's modulus leads to decreased maximum tensile stress, particularly as the adhesive joint becomes more asymmetric. Additionally, augmenting the Young's modulus of the underlying adhesive induces a redistribution of stress on the contact surface of the softer adhesive layer, while maintaining relatively unchanged stress distribution on the opposing adhesive surface. |
| format | Article |
| id | doaj-art-e1de6904547c4e3fadb142394caf4f81 |
| institution | Kabale University |
| issn | 2821-0263 |
| language | English |
| publishDate | 2024-06-01 |
| publisher | Bilijipub publisher |
| record_format | Article |
| series | Advances in Engineering and Intelligence Systems |
| spelling | doaj-art-e1de6904547c4e3fadb142394caf4f812025-02-12T08:47:56ZengBilijipub publisherAdvances in Engineering and Intelligence Systems2821-02632024-06-0100302183410.22034/aeis.2024.454482.1187199132Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization AlgorithmDamilare Adewunmi0Chisom Samuel1Antonio Fontana2Department of Civil and Environmental Engineering, University of Lagos, Akoka, Lagos, 100213, NigeriaDepartment of Mechanical Engineering, Landmark University, Omu Aran, Kwara, 251103, NigeriaDepartment Engineering Enzo Ferrari, University of Modena and Reggio Emilia, Modena, 41121, ItalyThis study presents a novel approach aimed at determining optimal parameters for minimizing peeling stress in asymmetric single-lap adhesive joints. Normal and shear stress distributions within this joint configuration are derived analytically through two-dimensional elasticity equations, demonstrating the accuracy of the analytical approach through comparison with finite element model. Peeling stress reduction is achieved through application of the Firefly optimization algorithm, where independent variables include the thicknesses of the adhesive and adherends layers. Under tensile loading conditions, the composite joint is analyzed assuming isotropic and linear elastic behavior of the adhesive and adherends layers. Findings indicate a significant reduction in peeling stress of approximately 31% with an optimal thickness ratio of 2.44 for adhesive. Moreover, an increase in the ratio of Young's modulus leads to decreased maximum tensile stress, particularly as the adhesive joint becomes more asymmetric. Additionally, augmenting the Young's modulus of the underlying adhesive induces a redistribution of stress on the contact surface of the softer adhesive layer, while maintaining relatively unchanged stress distribution on the opposing adhesive surface.https://aeis.bilijipub.com/article_199132_d042e10f484aa825268e5cbab33570ac.pdfasymmetric single-lap adhesive jointpeeling stressfirefly optimization algorithmadhesive thicknessadherends layersstress distribution |
| spellingShingle | Damilare Adewunmi Chisom Samuel Antonio Fontana Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm Advances in Engineering and Intelligence Systems asymmetric single-lap adhesive joint peeling stress firefly optimization algorithm adhesive thickness adherends layers stress distribution |
| title | Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm |
| title_full | Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm |
| title_fullStr | Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm |
| title_full_unstemmed | Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm |
| title_short | Minimization of Peeling Stress in Asymmetric Single-Lap Adhesive Joint Via Firefly Optimization Algorithm |
| title_sort | minimization of peeling stress in asymmetric single lap adhesive joint via firefly optimization algorithm |
| topic | asymmetric single-lap adhesive joint peeling stress firefly optimization algorithm adhesive thickness adherends layers stress distribution |
| url | https://aeis.bilijipub.com/article_199132_d042e10f484aa825268e5cbab33570ac.pdf |
| work_keys_str_mv | AT damilareadewunmi minimizationofpeelingstressinasymmetricsinglelapadhesivejointviafireflyoptimizationalgorithm AT chisomsamuel minimizationofpeelingstressinasymmetricsinglelapadhesivejointviafireflyoptimizationalgorithm AT antoniofontana minimizationofpeelingstressinasymmetricsinglelapadhesivejointviafireflyoptimizationalgorithm |