Research on Lifespan Prediction Methods Using Ultrasonic Microimaging for Electronic Packaging
Addressing the issue of lifespan prediction for electronic packages under thermal loading, this paper proposes a method for predicting the lifespan of electronic packages based on ultrasonic microimaging. Firstly, experimental samples equipped with flip-chip packages were designed and fabricated and...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-03-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/15/6/3246 |
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