The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys
The effects of gallium additions on microstructures and thermal and mechanical properties of the Sn-9Zn solder alloys are investigated in this study. The results show that the melting temperature of the alloys decreases with the increase in the Ga concentration, while the pasty ranges of the alloys...
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| Format: | Article |
| Language: | English |
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Wiley
2014-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2014/606814 |
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| author | Kang I. Chen Shou C. Cheng Chin H. Cheng Sean Wu Yeu-L. Jiang Tsung-C. Cheng |
| author_facet | Kang I. Chen Shou C. Cheng Chin H. Cheng Sean Wu Yeu-L. Jiang Tsung-C. Cheng |
| author_sort | Kang I. Chen |
| collection | DOAJ |
| description | The effects of gallium additions on microstructures and thermal and mechanical properties of the Sn-9Zn solder alloys are investigated in this study. The results show that the melting temperature of the alloys decreases with the increase in the Ga concentration, while the pasty ranges of the alloys are simultaneously enlarged. By adding a 0.25–0.5 wt.% Ga element, the Sn-matrix region is slightly increased and the Zn-rich phase becomes slightly coarser; however, the overall microstructure is still very similar to that of the Sn-9Zn alloy. It is found that, when the Ga concentration is less than 0.50 wt.%, the ultimate tensile strength and elongation are maintained at the same values. The addition of a 0.25–0.50 wt.% Ga to the Sn-9Zn alloy also leads to small cup and cone fracture surfaces which exhibit near-complete ductile fracturing. With the addition being increased to 0.75 wt.%, larger cup and cone fractures are observed. The 1.00 wt.% Ga alloy has lower strength and ductility due to the coarser and nonuniform microstructures. However, the fracture surfaces of the 1.00 wt.% Ga alloy show partial cleavage and a partially dimpled fracture. |
| format | Article |
| id | doaj-art-e05dec10ef4b4673ae90ef9801afe251 |
| institution | OA Journals |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2014-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-e05dec10ef4b4673ae90ef9801afe2512025-08-20T02:21:28ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422014-01-01201410.1155/2014/606814606814The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder AlloysKang I. Chen0Shou C. Cheng1Chin H. Cheng2Sean Wu3Yeu-L. Jiang4Tsung-C. Cheng5Department of Electronics Engineering and Computer Science, Tung Fang Design Institute, No. 110, Dong Fang Road, Hunei, Kaohsiung 82941, TaiwanDepartment of Electronics Engineering and Computer Science, Tung Fang Design Institute, No. 110, Dong Fang Road, Hunei, Kaohsiung 82941, TaiwanDepartment of Aeronautics and Astronautics, Research Center for Energy Technology and Strategy, National Cheng Kung University, Tainan 70101, TaiwanDepartment of Electronics Engineering and Computer Science, Tung Fang Design Institute, No. 110, Dong Fang Road, Hunei, Kaohsiung 82941, TaiwanDepartment of Electrical Engineering, National Chung Hsing University, Taichung 40227, TaiwanDepartment of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 80778, TaiwanThe effects of gallium additions on microstructures and thermal and mechanical properties of the Sn-9Zn solder alloys are investigated in this study. The results show that the melting temperature of the alloys decreases with the increase in the Ga concentration, while the pasty ranges of the alloys are simultaneously enlarged. By adding a 0.25–0.5 wt.% Ga element, the Sn-matrix region is slightly increased and the Zn-rich phase becomes slightly coarser; however, the overall microstructure is still very similar to that of the Sn-9Zn alloy. It is found that, when the Ga concentration is less than 0.50 wt.%, the ultimate tensile strength and elongation are maintained at the same values. The addition of a 0.25–0.50 wt.% Ga to the Sn-9Zn alloy also leads to small cup and cone fracture surfaces which exhibit near-complete ductile fracturing. With the addition being increased to 0.75 wt.%, larger cup and cone fractures are observed. The 1.00 wt.% Ga alloy has lower strength and ductility due to the coarser and nonuniform microstructures. However, the fracture surfaces of the 1.00 wt.% Ga alloy show partial cleavage and a partially dimpled fracture.http://dx.doi.org/10.1155/2014/606814 |
| spellingShingle | Kang I. Chen Shou C. Cheng Chin H. Cheng Sean Wu Yeu-L. Jiang Tsung-C. Cheng The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys Advances in Materials Science and Engineering |
| title | The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys |
| title_full | The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys |
| title_fullStr | The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys |
| title_full_unstemmed | The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys |
| title_short | The Effects of Gallium Additions on Microstructures and Thermal and Mechanical Properties of Sn-9Zn Solder Alloys |
| title_sort | effects of gallium additions on microstructures and thermal and mechanical properties of sn 9zn solder alloys |
| url | http://dx.doi.org/10.1155/2014/606814 |
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