Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays

Abstract In the current work, the effect of the surface phase structure of silicon wafer on the copper assisted chemical etching (Cu-ACE) behavior was investigated by adopting N-type monocrystal silicon with different thickness as raw material. An inverted pyramid structure was prepared with the met...

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Main Authors: YuXin Zou, Xuan Liu, Mingjun Wang, Yating Song, Huan Liu, Shihao Hong, Fengshuo Xi
Format: Article
Language:English
Published: SpringerOpen 2024-11-01
Series:Materials for Renewable and Sustainable Energy
Subjects:
Online Access:https://doi.org/10.1007/s40243-024-00277-4
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author YuXin Zou
Xuan Liu
Mingjun Wang
Yating Song
Huan Liu
Shihao Hong
Fengshuo Xi
author_facet YuXin Zou
Xuan Liu
Mingjun Wang
Yating Song
Huan Liu
Shihao Hong
Fengshuo Xi
author_sort YuXin Zou
collection DOAJ
description Abstract In the current work, the effect of the surface phase structure of silicon wafer on the copper assisted chemical etching (Cu-ACE) behavior was investigated by adopting N-type monocrystal silicon with different thickness as raw material. An inverted pyramid structure was prepared with the method of Cu-ACE, which exhibited a mild reaction temperature with the reflectance reaching as low as 6.34%. Furthermore, cetyltrimethylammonium bromide (CTAB) was employed as an additive to optimize the Cu-ACE process. The study revealed that CTAB molecules could adsorb Cu2+ near the silicon wafer surface in the HF/Cu(NO3)2/H2O2 solution, thereby promoting the deposition of copper particles and ensuring a uniform etching reaction. When 3 mg of CTAB was added to 100 mL of etching solution, the inverted pyramid structure showed larger dimensions and was more uniformly distributed, an excellent antireflection effect was achieved with the reflectance significantly reduced from 10.8% to 4.6%. This process could stably fabricate inverted pyramid structures, and is expected to advance the development of high-efficiency single-crystal solar cells in the future.
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institution Kabale University
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language English
publishDate 2024-11-01
publisher SpringerOpen
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series Materials for Renewable and Sustainable Energy
spelling doaj-art-e04c67313c614092a09a46614aa564f32025-08-20T03:53:32ZengSpringerOpenMaterials for Renewable and Sustainable Energy2194-14592194-14672024-11-011411910.1007/s40243-024-00277-4Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arraysYuXin Zou0Xuan Liu1Mingjun Wang2Yating Song3Huan Liu4Shihao Hong5Fengshuo Xi6Xiangtan Institute of TechnologyXiangtan Institute of TechnologyXiangtan Institute of TechnologyXiangtan Institute of TechnologyXiangtan Institute of TechnologyBYD New Material DivisionFaculty of Metallurgical and Energy Engineering, State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization, Kunming University of Science and TechnologyAbstract In the current work, the effect of the surface phase structure of silicon wafer on the copper assisted chemical etching (Cu-ACE) behavior was investigated by adopting N-type monocrystal silicon with different thickness as raw material. An inverted pyramid structure was prepared with the method of Cu-ACE, which exhibited a mild reaction temperature with the reflectance reaching as low as 6.34%. Furthermore, cetyltrimethylammonium bromide (CTAB) was employed as an additive to optimize the Cu-ACE process. The study revealed that CTAB molecules could adsorb Cu2+ near the silicon wafer surface in the HF/Cu(NO3)2/H2O2 solution, thereby promoting the deposition of copper particles and ensuring a uniform etching reaction. When 3 mg of CTAB was added to 100 mL of etching solution, the inverted pyramid structure showed larger dimensions and was more uniformly distributed, an excellent antireflection effect was achieved with the reflectance significantly reduced from 10.8% to 4.6%. This process could stably fabricate inverted pyramid structures, and is expected to advance the development of high-efficiency single-crystal solar cells in the future.https://doi.org/10.1007/s40243-024-00277-4DWS N-type silicon waferCopper assisted chemical etchingInverted pyramid texturingUltra-low reflectivitySolar Cell
spellingShingle YuXin Zou
Xuan Liu
Mingjun Wang
Yating Song
Huan Liu
Shihao Hong
Fengshuo Xi
Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays
Materials for Renewable and Sustainable Energy
DWS N-type silicon wafer
Copper assisted chemical etching
Inverted pyramid texturing
Ultra-low reflectivity
Solar Cell
title Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays
title_full Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays
title_fullStr Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays
title_full_unstemmed Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays
title_short Study on the stable preparation and optimization treatment of DWS N-type single-crystal silicon pyramid arrays
title_sort study on the stable preparation and optimization treatment of dws n type single crystal silicon pyramid arrays
topic DWS N-type silicon wafer
Copper assisted chemical etching
Inverted pyramid texturing
Ultra-low reflectivity
Solar Cell
url https://doi.org/10.1007/s40243-024-00277-4
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