Hu, X., Qi, Z., Wang, H., & Zhang, X. Performance of InGaN-Based Thin-Film LEDs With Flip-Chip Configuration and Concavely Patterned Surface Fabricated on Electroplating Metallic Substrate. IEEE.
Chicago Style (17th ed.) CitationHu, Xiao-Long, Zhao-Yi Qi, Hong Wang, and Xi-Chun Zhang. Performance of InGaN-Based Thin-Film LEDs With Flip-Chip Configuration and Concavely Patterned Surface Fabricated on Electroplating Metallic Substrate. IEEE.
MLA (9th ed.) CitationHu, Xiao-Long, et al. Performance of InGaN-Based Thin-Film LEDs With Flip-Chip Configuration and Concavely Patterned Surface Fabricated on Electroplating Metallic Substrate. IEEE.
Warning: These citations may not always be 100% accurate.