Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks

Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks

Abstract Rapid advancements in electronic devices yield an urgent demand for high‐performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the req...

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Bibliographic Details
Main Authors: Minjun Ai, Yuzhu Song, Feixiang Long, Yuanpeng Zhang, Ke An, Dunji Yu, Yan Chen, Yuki Sakai, Masahito Ikeda, Kazuki Takahashi, Masaki Azuma, Naike Shi, Chang Zhou, Jun Chen
Format: Article
Language:English
Published: Wiley 2024-10-01
Series:Advanced Science
Subjects:
copper networks
eutectic precipitation
high thermal conductivity
negative thermal expansion
Online Access:https://doi.org/10.1002/advs.202404838
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