Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems

Abstract Rapid advancements in communication technologies, such as the onset of 5G systems and the anticipated arrival of 6G systems, have increased the demand for materials with low relative permittivity ( $$\varepsilon_{r}$$ ) and dissipation factor (tanδ) to enable stable, low-power communication...

Full description

Saved in:
Bibliographic Details
Main Authors: Seisuke Ata, Takumi Ono, Yuto Kato
Format: Article
Language:English
Published: Nature Portfolio 2025-07-01
Series:Scientific Reports
Subjects:
Online Access:https://doi.org/10.1038/s41598-025-13533-y
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1849235183202467840
author Seisuke Ata
Takumi Ono
Yuto Kato
author_facet Seisuke Ata
Takumi Ono
Yuto Kato
author_sort Seisuke Ata
collection DOAJ
description Abstract Rapid advancements in communication technologies, such as the onset of 5G systems and the anticipated arrival of 6G systems, have increased the demand for materials with low relative permittivity ( $$\varepsilon_{r}$$ ) and dissipation factor (tanδ) to enable stable, low-power communication at higher frequencies. In this study, cycloolefin polymer (COP)-based composites containing an alumina (Al2O3) or aluminum nitride (AlN) filler were subjected to foaming by supercritical CO2 to introduce porosity, then evaluated as candidates for low- $$\varepsilon_{r}$$  , low-tanδ substrates. Their dielectric properties were evaluated over a large frequency range of up to ~ 120 GHz using the balanced-type circular disk resonator method. The results demonstrated that porosity effectively reduced $$\varepsilon_{r}$$ and tanδ without compromising the thermal properties; in particular, the COP–AlN composites exhibited $$\varepsilon_{r}$$ and tanδ values below 2.0 and 1 × 10–3, respectively. Furthermore, the $$\:{\varepsilon\:}_{r}$$ trend was consistent with effective medium theories, specifically the Maxwell–Garnett and Bruggeman models. Additional analyses of the thermal expansion and conductivities of the composites revealed enhanced compatibility with copper conductors, supporting the viability of these composites for next-generation communication devices.
format Article
id doaj-art-df39a9e0bd9d481ebcaa6b7a272477af
institution Kabale University
issn 2045-2322
language English
publishDate 2025-07-01
publisher Nature Portfolio
record_format Article
series Scientific Reports
spelling doaj-art-df39a9e0bd9d481ebcaa6b7a272477af2025-08-20T04:02:51ZengNature PortfolioScientific Reports2045-23222025-07-0115111010.1038/s41598-025-13533-yDevelopment of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systemsSeisuke Ata0Takumi Ono1Yuto Kato2Research Institute for Chemical Process Technology, National Institute of Advanced Industrial Science and TechnologyResearch Institute for Chemical Process Technology, National Institute of Advanced Industrial Science and TechnologyNational Institute of Advanced Industrial Science and Technology, National Metrology Institute of JapanAbstract Rapid advancements in communication technologies, such as the onset of 5G systems and the anticipated arrival of 6G systems, have increased the demand for materials with low relative permittivity ( $$\varepsilon_{r}$$ ) and dissipation factor (tanδ) to enable stable, low-power communication at higher frequencies. In this study, cycloolefin polymer (COP)-based composites containing an alumina (Al2O3) or aluminum nitride (AlN) filler were subjected to foaming by supercritical CO2 to introduce porosity, then evaluated as candidates for low- $$\varepsilon_{r}$$  , low-tanδ substrates. Their dielectric properties were evaluated over a large frequency range of up to ~ 120 GHz using the balanced-type circular disk resonator method. The results demonstrated that porosity effectively reduced $$\varepsilon_{r}$$ and tanδ without compromising the thermal properties; in particular, the COP–AlN composites exhibited $$\varepsilon_{r}$$ and tanδ values below 2.0 and 1 × 10–3, respectively. Furthermore, the $$\:{\varepsilon\:}_{r}$$ trend was consistent with effective medium theories, specifically the Maxwell–Garnett and Bruggeman models. Additional analyses of the thermal expansion and conductivities of the composites revealed enhanced compatibility with copper conductors, supporting the viability of these composites for next-generation communication devices.https://doi.org/10.1038/s41598-025-13533-yLow-Dielectric substratesPorous COP compositesSupercritical CO2 foamingDissipation factor (tan δ)High-Frequency dielectric properties
spellingShingle Seisuke Ata
Takumi Ono
Yuto Kato
Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems
Scientific Reports
Low-Dielectric substrates
Porous COP composites
Supercritical CO2 foaming
Dissipation factor (tan δ)
High-Frequency dielectric properties
title Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems
title_full Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems
title_fullStr Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems
title_full_unstemmed Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems
title_short Development of porous COP–ceramic composites for application as low-relative-permittivity, low-dielectric-loss substrates in next-generation communication systems
title_sort development of porous cop ceramic composites for application as low relative permittivity low dielectric loss substrates in next generation communication systems
topic Low-Dielectric substrates
Porous COP composites
Supercritical CO2 foaming
Dissipation factor (tan δ)
High-Frequency dielectric properties
url https://doi.org/10.1038/s41598-025-13533-y
work_keys_str_mv AT seisukeata developmentofporouscopceramiccompositesforapplicationaslowrelativepermittivitylowdielectriclosssubstratesinnextgenerationcommunicationsystems
AT takumiono developmentofporouscopceramiccompositesforapplicationaslowrelativepermittivitylowdielectriclosssubstratesinnextgenerationcommunicationsystems
AT yutokato developmentofporouscopceramiccompositesforapplicationaslowrelativepermittivitylowdielectriclosssubstratesinnextgenerationcommunicationsystems