APA (7th ed.) Citation

Ying, L., ChunYue, H., Rui, Y., Wei, H., TianMing, L., & HongWang, Z. STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING. Editorial Office of Journal of Mechanical Strength.

Chicago Style (17th ed.) Citation

Ying, LIANG, HUANG ChunYue, YIN Rui, HUANG Wei, LI TianMing, and ZHAO HongWang. STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING. Editorial Office of Journal of Mechanical Strength.

MLA (9th ed.) Citation

Ying, LIANG, et al. STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING. Editorial Office of Journal of Mechanical Strength.