CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications

Abstract HfOx‐based resistive random‐access‐memory (ReRAM) devices (TiN/Ti/HfOx/RuOx/TiN) are fabricated by CMOS‐compatible materials (ruthenium (Ru)) and lithography‐lite process, potentially enabling a maskless, etching‐free process that can be implemented in the low earth orbit (LEO), the Interna...

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Main Authors: Yao‐Feng Chang, Yifu Huang, Chin‐Han Chung, Ying‐Chen Chen
Format: Article
Language:English
Published: Wiley-VCH 2025-06-01
Series:Advanced Electronic Materials
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Online Access:https://doi.org/10.1002/aelm.202400823
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author Yao‐Feng Chang
Yifu Huang
Chin‐Han Chung
Ying‐Chen Chen
author_facet Yao‐Feng Chang
Yifu Huang
Chin‐Han Chung
Ying‐Chen Chen
author_sort Yao‐Feng Chang
collection DOAJ
description Abstract HfOx‐based resistive random‐access‐memory (ReRAM) devices (TiN/Ti/HfOx/RuOx/TiN) are fabricated by CMOS‐compatible materials (ruthenium (Ru)) and lithography‐lite process, potentially enabling a maskless, etching‐free process that can be implemented in the low earth orbit (LEO), the International Space Station (ISS), and commercial LEO destinations (CLDs). The devices met the requirements for qualified manufacturers list verification (QMLV) and radiation hardness assurance (QMLV‐RHA), as well as Advanced Next Generation Strategic Radiation, hardened Memory (ANGSTRM), which potentially support LEO, medium earth orbit, and geosynchronous orbit missions. Specifically, after a 5‐Mrad total ionizing dose (TID) test, the electrical characterized results showed non‐degradation performance, memory window ≈40 with operation power <   mW, capability of >  000‐times endurance and 15‐year retention. The Ruthenium oxide (RuOx) can serve as a photon‐absorb sink to reduce the switching layer damage caused by heating induced by radiation, supported by Particle and Heavy Ion Transport Code System Monte Carlo simulation. Furthermore, the neural network by HfOx/RuOx‐based ReRAM device is trained with the inference accuracy at various TIDs for a potential neuromorphic hardware system demonstration. The results show that HfOx/RuOx‐based ReRAM neuromorphic computing is quite robust as a radiation‐hardened structure, providing a development path to realize programmable computing chip tolerance under irradiation.
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issn 2199-160X
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spelling doaj-art-dc49c413e3cf4bba94e0a00238b0bc722025-08-20T02:07:24ZengWiley-VCHAdvanced Electronic Materials2199-160X2025-06-01119n/an/a10.1002/aelm.202400823CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing ApplicationsYao‐Feng Chang0Yifu Huang1Chin‐Han Chung2Ying‐Chen Chen3Intel Corporation 2501 NE Century Blvd Hillsboro Oregon 97124‐5503 USADepartment of Electrical and Computer Engineering University of Texas at Austin 10100 Burnet Road Austin TX 78758 USAInternational College of Semiconductor Technology National Yang Ming Chiao Tung University (NYCU) Hsinchu 30010 TaiwanSchool of Electrical Computer and Energy Engineering Arizona State University Tempe AZ 85287 USAAbstract HfOx‐based resistive random‐access‐memory (ReRAM) devices (TiN/Ti/HfOx/RuOx/TiN) are fabricated by CMOS‐compatible materials (ruthenium (Ru)) and lithography‐lite process, potentially enabling a maskless, etching‐free process that can be implemented in the low earth orbit (LEO), the International Space Station (ISS), and commercial LEO destinations (CLDs). The devices met the requirements for qualified manufacturers list verification (QMLV) and radiation hardness assurance (QMLV‐RHA), as well as Advanced Next Generation Strategic Radiation, hardened Memory (ANGSTRM), which potentially support LEO, medium earth orbit, and geosynchronous orbit missions. Specifically, after a 5‐Mrad total ionizing dose (TID) test, the electrical characterized results showed non‐degradation performance, memory window ≈40 with operation power <   mW, capability of >  000‐times endurance and 15‐year retention. The Ruthenium oxide (RuOx) can serve as a photon‐absorb sink to reduce the switching layer damage caused by heating induced by radiation, supported by Particle and Heavy Ion Transport Code System Monte Carlo simulation. Furthermore, the neural network by HfOx/RuOx‐based ReRAM device is trained with the inference accuracy at various TIDs for a potential neuromorphic hardware system demonstration. The results show that HfOx/RuOx‐based ReRAM neuromorphic computing is quite robust as a radiation‐hardened structure, providing a development path to realize programmable computing chip tolerance under irradiation.https://doi.org/10.1002/aelm.202400823BEOLemerging memorymemristorRRAM
spellingShingle Yao‐Feng Chang
Yifu Huang
Chin‐Han Chung
Ying‐Chen Chen
CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications
Advanced Electronic Materials
BEOL
emerging memory
memristor
RRAM
title CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications
title_full CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications
title_fullStr CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications
title_full_unstemmed CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications
title_short CMOS‐Compatible HfOx‐Based Radiation Hardening Component for Neuromorphic Computing Applications
title_sort cmos compatible hfox based radiation hardening component for neuromorphic computing applications
topic BEOL
emerging memory
memristor
RRAM
url https://doi.org/10.1002/aelm.202400823
work_keys_str_mv AT yaofengchang cmoscompatiblehfoxbasedradiationhardeningcomponentforneuromorphiccomputingapplications
AT yifuhuang cmoscompatiblehfoxbasedradiationhardeningcomponentforneuromorphiccomputingapplications
AT chinhanchung cmoscompatiblehfoxbasedradiationhardeningcomponentforneuromorphiccomputingapplications
AT yingchenchen cmoscompatiblehfoxbasedradiationhardeningcomponentforneuromorphiccomputingapplications