Characterization of electrolytically developed copper filled epoxy adhesive for space applications
The pursuit of advanced materials for space applications accelerates the development of new materials that exhibits excellent thermal, mechanical, and electrical properties under extreme environments. This study focuses on optimizing copper loading levels within epoxy matrices (ranging from 35 % to...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-03-01
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| Series: | Hybrid Advances |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773207X24002239 |
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| author | Akhil K. Poddar Siddharth S. Patel A. Kumar Hitesh D. Patel B. Satyanarayana |
| author_facet | Akhil K. Poddar Siddharth S. Patel A. Kumar Hitesh D. Patel B. Satyanarayana |
| author_sort | Akhil K. Poddar |
| collection | DOAJ |
| description | The pursuit of advanced materials for space applications accelerates the development of new materials that exhibits excellent thermal, mechanical, and electrical properties under extreme environments. This study focuses on optimizing copper loading levels within epoxy matrices (ranging from 35 % to 55 %) to evaluate how variations in copper content impact the composite's physico-chemical stability, thermal conductivity, controlled outgassing properties and adhesive strength. In addition, this study also discusses the result of specific modifications of epoxy resin system aiming to assess the suitability of resultant composites for space applications. Characterization involved sample preparation from each set, followed by various testing and analysis methods including Thermogravimetric Analysis (TGA), Scanning Electron Microscopy (SEM), Fourier Transform Infrared Spectroscopy (FTIR), Lap shear strength measurement, outgassing property evaluation, and thermal conductivity testing. As a result, this research findings suggest that 50 % copper filled epoxy composites shows potential as good thermal conductive adhesives for space applications. |
| format | Article |
| id | doaj-art-db48abb71ee44a7bb2a8f1ba0a115bc5 |
| institution | Kabale University |
| issn | 2773-207X |
| language | English |
| publishDate | 2025-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Hybrid Advances |
| spelling | doaj-art-db48abb71ee44a7bb2a8f1ba0a115bc52024-12-29T04:48:21ZengElsevierHybrid Advances2773-207X2025-03-018100362Characterization of electrolytically developed copper filled epoxy adhesive for space applicationsAkhil K. Poddar0Siddharth S. Patel1A. Kumar2Hitesh D. Patel3B. Satyanarayana4Space Applications Centre (SAC-ISRO), Ahmedabad, India; Department of Chemistry, School of Science, Gujarat University, Ahmedabad, IndiaDepartment of Chemistry, School of Science, Gujarat University, Ahmedabad, India; Department of Chemistry, SRICT-Institute of Science and Research, UPL University, Ankleshwar, Gujarat, India; Corresponding author. Department of Chemistry, School of Science, Gujarat University, Ahmedabad, India.Space Applications Centre (SAC-ISRO), Ahmedabad, IndiaDepartment of Chemistry, School of Science, Gujarat University, Ahmedabad, IndiaSpace Applications Centre (SAC-ISRO), Ahmedabad, IndiaThe pursuit of advanced materials for space applications accelerates the development of new materials that exhibits excellent thermal, mechanical, and electrical properties under extreme environments. This study focuses on optimizing copper loading levels within epoxy matrices (ranging from 35 % to 55 %) to evaluate how variations in copper content impact the composite's physico-chemical stability, thermal conductivity, controlled outgassing properties and adhesive strength. In addition, this study also discusses the result of specific modifications of epoxy resin system aiming to assess the suitability of resultant composites for space applications. Characterization involved sample preparation from each set, followed by various testing and analysis methods including Thermogravimetric Analysis (TGA), Scanning Electron Microscopy (SEM), Fourier Transform Infrared Spectroscopy (FTIR), Lap shear strength measurement, outgassing property evaluation, and thermal conductivity testing. As a result, this research findings suggest that 50 % copper filled epoxy composites shows potential as good thermal conductive adhesives for space applications.http://www.sciencedirect.com/science/article/pii/S2773207X24002239CompositeConductivityCopper powderCuringFiller |
| spellingShingle | Akhil K. Poddar Siddharth S. Patel A. Kumar Hitesh D. Patel B. Satyanarayana Characterization of electrolytically developed copper filled epoxy adhesive for space applications Hybrid Advances Composite Conductivity Copper powder Curing Filler |
| title | Characterization of electrolytically developed copper filled epoxy adhesive for space applications |
| title_full | Characterization of electrolytically developed copper filled epoxy adhesive for space applications |
| title_fullStr | Characterization of electrolytically developed copper filled epoxy adhesive for space applications |
| title_full_unstemmed | Characterization of electrolytically developed copper filled epoxy adhesive for space applications |
| title_short | Characterization of electrolytically developed copper filled epoxy adhesive for space applications |
| title_sort | characterization of electrolytically developed copper filled epoxy adhesive for space applications |
| topic | Composite Conductivity Copper powder Curing Filler |
| url | http://www.sciencedirect.com/science/article/pii/S2773207X24002239 |
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