Investigation on the Mechanical and Thermal Insulation Properties of Hollow Microspheres/Phenolic Syntactic Foams
Hollow microspheres are widely used in syntactic foam as a lightweight filling material. Hollow glass microspheres (HGM) and hollow phenolic microspheres (HPM) were added to the phenolic resin to prepare phenolic syntactic foams. Then the mechanical properties, thermal insulation properties, and the...
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Main Authors: | Jing Dai, Chao Peng, Shuyue Zhang, Shun Wu, Minxian Shi, Zhixiong Huang |
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Format: | Article |
Language: | English |
Published: |
Wiley
2022-01-01
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Series: | Advances in Materials Science and Engineering |
Online Access: | http://dx.doi.org/10.1155/2022/2509090 |
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