Dai, J., Peng, C., Zhang, S., Wu, S., Shi, M., & Huang, Z. Investigation on the Mechanical and Thermal Insulation Properties of Hollow Microspheres/Phenolic Syntactic Foams. Wiley.
Chicago Style (17th ed.) CitationDai, Jing, Chao Peng, Shuyue Zhang, Shun Wu, Minxian Shi, and Zhixiong Huang. Investigation on the Mechanical and Thermal Insulation Properties of Hollow Microspheres/Phenolic Syntactic Foams. Wiley.
MLA (9th ed.) CitationDai, Jing, et al. Investigation on the Mechanical and Thermal Insulation Properties of Hollow Microspheres/Phenolic Syntactic Foams. Wiley.
Warning: These citations may not always be 100% accurate.