The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder
Saved in:
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1977-01-01
|
| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.4.43 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|