The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder
Saved in:
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1977-01-01
|
| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.4.43 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1850167128677679104 |
|---|---|
| author | L. J. Rickabaugh |
| author_facet | L. J. Rickabaugh |
| author_sort | L. J. Rickabaugh |
| collection | DOAJ |
| format | Article |
| id | doaj-art-d97dcf557fcc45b4a9df4c6a57f600d7 |
| institution | OA Journals |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 1977-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-d97dcf557fcc45b4a9df4c6a57f600d72025-08-20T02:21:16ZengWileyActive and Passive Electronic Components0882-75161563-50311977-01-0141434610.1155/APEC.4.43The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb SolderL. J. Rickabaughhttp://dx.doi.org/10.1155/APEC.4.43 |
| spellingShingle | L. J. Rickabaugh The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder Active and Passive Electronic Components |
| title | The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder |
| title_full | The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder |
| title_fullStr | The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder |
| title_full_unstemmed | The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder |
| title_short | The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder |
| title_sort | effect of thin film deposition angle and substrate surface roughness on film dissolution in molten 60 37 sn 8211 40 37 pb solder |
| url | http://dx.doi.org/10.1155/APEC.4.43 |
| work_keys_str_mv | AT ljrickabaugh theeffectofthinfilmdepositionangleandsubstratesurfaceroughnessonfilmdissolutioninmolten6037sn82114037pbsolder AT ljrickabaugh effectofthinfilmdepositionangleandsubstratesurfaceroughnessonfilmdissolutioninmolten6037sn82114037pbsolder |