Rickabaugh, L. J. The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder. Wiley.
Chicago Style (17th ed.) CitationRickabaugh, L. J. The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder. Wiley.
MLA (9th ed.) CitationRickabaugh, L. J. The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder. Wiley.
Warning: These citations may not always be 100% accurate.