Chemical Etching of {hk0} Silicon Plates in EDP Part I: Experiments and Comparison with TMAH
This paper deals with the anisotropic chemical etching of various silicon plates etched in EDP. Changes with orientation in geometrical features of etched surface and in the etching shape of starting circular sections are systematically investigated. These etching shapes are compared with shapes pro...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2000-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.23.37 |
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| Summary: | This paper deals with the anisotropic chemical etching of various silicon plates etched in
EDP. Changes with orientation in geometrical features of etched surface and in the
etching shape of starting circular sections are systematically investigated. These etching
shapes are compared with shapes produced by etching in KOH and TMAH solutions;
This experimental study allows us to determine the dissolution slowness surface for the
EDP solution and to investigate the real influence of the etchant on two dimensional and
three dimensional etching shapes. |
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| ISSN: | 0882-7516 1563-5031 |