MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation

This work presents aluminum nitride (AlN)/gallium nitride (GaN)/AlN high electron mobility transistors (HEMTs) on 100 mm silicon carbide (SiC) fabricated using a commercial 150 nm RF GaN foundry process. High electrical performance uniformity across the wafer surface is demonstrated. The thin 3 nm A...

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Main Authors: Reet Chaudhuri, Kyle Bothe, Antonio Lucero, Austin Hickman, Shankar Miller-Murthy, Debdeep Jena, Huili Grace Xing, Ko-Tao Lee
Format: Article
Language:English
Published: IOP Publishing 2025-01-01
Series:Applied Physics Express
Online Access:https://doi.org/10.35848/1882-0786/ade6c0
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_version_ 1849430920081178624
author Reet Chaudhuri
Kyle Bothe
Antonio Lucero
Austin Hickman
Shankar Miller-Murthy
Debdeep Jena
Huili Grace Xing
Ko-Tao Lee
author_facet Reet Chaudhuri
Kyle Bothe
Antonio Lucero
Austin Hickman
Shankar Miller-Murthy
Debdeep Jena
Huili Grace Xing
Ko-Tao Lee
author_sort Reet Chaudhuri
collection DOAJ
description This work presents aluminum nitride (AlN)/gallium nitride (GaN)/AlN high electron mobility transistors (HEMTs) on 100 mm silicon carbide (SiC) fabricated using a commercial 150 nm RF GaN foundry process. High electrical performance uniformity across the wafer surface is demonstrated. The thin 3 nm AlN barrier, low ohmic contact resistances (0.09 Ω.mm), and high-density (1.26 × 10 ^13 cm ^−2 ) 2DEG channel results in high transconductances of ∼640 mS mm ^−1 (maximum of 736 mS mm ^−1 ) and on-currents ∼1.5 A mm ^−1 . A peak power output of 2.68 W mm ^−1 at power added efficiency (PAE) of 32% at Ka-band is measured. These results represent a significant step towards technology maturity for the AlN/GaN/AlN HEMTs by demonstrating their compatibility with current GaN foundry processes.
format Article
id doaj-art-d9129e41d2424d7c893dc60a06e068c4
institution Kabale University
issn 1882-0786
language English
publishDate 2025-01-01
publisher IOP Publishing
record_format Article
series Applied Physics Express
spelling doaj-art-d9129e41d2424d7c893dc60a06e068c42025-08-20T03:27:48ZengIOP PublishingApplied Physics Express1882-07862025-01-0118707650110.35848/1882-0786/ade6c0MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operationReet Chaudhuri0https://orcid.org/0000-0002-6562-4506Kyle Bothe1Antonio Lucero2Austin Hickman3https://orcid.org/0000-0002-6762-1405Shankar Miller-Murthy4Debdeep Jena5https://orcid.org/0000-0002-4076-4625Huili Grace Xing6https://orcid.org/0000-0002-2709-3839Ko-Tao Lee7Soctera Inc., Ithaca NY 14853, United States of AmericaQORVO Inc., Richardson, TX 75082, United States of AmericaQORVO Inc., Richardson, TX 75082, United States of AmericaSoctera Inc., Ithaca NY 14853, United States of AmericaSoctera Inc., Ithaca NY 14853, United States of AmericaSoctera Inc., Ithaca NY 14853, United States of AmericaSoctera Inc., Ithaca NY 14853, United States of AmericaQORVO Inc., Richardson, TX 75082, United States of AmericaThis work presents aluminum nitride (AlN)/gallium nitride (GaN)/AlN high electron mobility transistors (HEMTs) on 100 mm silicon carbide (SiC) fabricated using a commercial 150 nm RF GaN foundry process. High electrical performance uniformity across the wafer surface is demonstrated. The thin 3 nm AlN barrier, low ohmic contact resistances (0.09 Ω.mm), and high-density (1.26 × 10 ^13 cm ^−2 ) 2DEG channel results in high transconductances of ∼640 mS mm ^−1 (maximum of 736 mS mm ^−1 ) and on-currents ∼1.5 A mm ^−1 . A peak power output of 2.68 W mm ^−1 at power added efficiency (PAE) of 32% at Ka-band is measured. These results represent a significant step towards technology maturity for the AlN/GaN/AlN HEMTs by demonstrating their compatibility with current GaN foundry processes.https://doi.org/10.35848/1882-0786/ade6c0
spellingShingle Reet Chaudhuri
Kyle Bothe
Antonio Lucero
Austin Hickman
Shankar Miller-Murthy
Debdeep Jena
Huili Grace Xing
Ko-Tao Lee
MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation
Applied Physics Express
title MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation
title_full MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation
title_fullStr MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation
title_full_unstemmed MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation
title_short MOCVD-grown, ultra-thin barrier AlN/GaN/AlN HEMTs fabricated using commercial GaN foundry process for Ka-band operation
title_sort mocvd grown ultra thin barrier aln gan aln hemts fabricated using commercial gan foundry process for ka band operation
url https://doi.org/10.35848/1882-0786/ade6c0
work_keys_str_mv AT reetchaudhuri mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT kylebothe mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT antoniolucero mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT austinhickman mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT shankarmillermurthy mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT debdeepjena mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT huiligracexing mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation
AT kotaolee mocvdgrownultrathinbarrieralnganalnhemtsfabricatedusingcommercialganfoundryprocessforkabandoperation