Copper Materials System for Microcircuitry: A Status Report
Saved in:
| Main Authors: | R. O. Uhler, R. E. Funer, C. R. Needes, P. C. Donohue, J. D. Mitchell |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1981-01-01
|
| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.8.145 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Hybrid manufacturing and mechanics of copper-based architected materials and copper–aluminum interpenetrating phase composites
by: Abdulrahman Jaber, et al.
Published: (2025-09-01) -
Methodological Resources for Investigating the Failure Status of Electrical Wiring with Copper Conductors as the Cause of Fire
by: I. S. Taubkin, et al.
Published: (2018-09-01) -
Engineering copper and copper-based materials for a post-antibiotic era
by: Yingxian Wang, et al.
Published: (2025-08-01) -
Electrochemical forming of composite materials based on zinc and copper oxide
by: N. M. Tkachyonok, et al.
Published: (2020-09-01) -
Surface and Catalytic Properties of Copper Oxide, Manganese Oxide/Silica Systems
by: Nagi R.E. Radwan
Published: (1999-07-01)