APA (7th ed.) Citation

Lee, T., Chen, Y., Hwang, S., Ko, C., & Cheng, W. Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation. Elsevier.

Chicago Style (17th ed.) Citation

Lee, Ting-Yu, Yu-Li Chen, Sheng-Jye Hwang, Chun-Yu Ko, and Wei-Lun Cheng. Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical Simulation and Experimental Validation. Elsevier.

MLA (9th ed.) Citation

Lee, Ting-Yu, et al. Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical Simulation and Experimental Validation. Elsevier.