Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation
In-plane thermoelectric thin-film cooling devices are considered a promising solution for thermal management in electronic systems. However, the actual cooling performance is far below that of regular bulk cooling devices, making the design of thin-film devices much more difficult. In this work, a n...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/6/648 |
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