Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders
Magnetic-field-assisted soldering offered a promising approach for achieving high-reliability interconnects in space applications. In this study, Sn58Bi solder and its composites doped with 0.6 wt% Ni nanoparticles (NPs) or microparticles (MPs) were investigated to elucidate the effects of magnetic...
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| Main Authors: | Chuan-jiang Wu, Liang Zhang, Yu-hao Chen, Xin-quan Yu, Quan-Bin Lu, Wei-min Long |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525005787 |
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