Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders
Magnetic-field-assisted soldering offered a promising approach for achieving high-reliability interconnects in space applications. In this study, Sn58Bi solder and its composites doped with 0.6 wt% Ni nanoparticles (NPs) or microparticles (MPs) were investigated to elucidate the effects of magnetic...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-07-01
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| Series: | Materials & Design |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525005787 |
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| author | Chuan-jiang Wu Liang Zhang Yu-hao Chen Xin-quan Yu Quan-Bin Lu Wei-min Long |
| author_facet | Chuan-jiang Wu Liang Zhang Yu-hao Chen Xin-quan Yu Quan-Bin Lu Wei-min Long |
| author_sort | Chuan-jiang Wu |
| collection | DOAJ |
| description | Magnetic-field-assisted soldering offered a promising approach for achieving high-reliability interconnects in space applications. In this study, Sn58Bi solder and its composites doped with 0.6 wt% Ni nanoparticles (NPs) or microparticles (MPs) were investigated to elucidate the effects of magnetic fields on the behavior of magnetic solders, with particular focus on microstructural evolution, grain orientation, and mechanical performance. The classical lamellar eutectic structure was transformed into a honeycomb-like morphology under the applied magnetic field, accompanied by an increased dislocation density. Meanwhile, the magnetic field suppressed Ni particle agglomeration and promoted the precipitation of fine (Cu, Ni)6Sn5 grains between the Sn and Bi phases, which produced a pinning effect. It also inhibited intermetallic compounds (IMC) layer growth, refined the IMC grains, and preserved their orientation. Consequently, the shear strength of joints soldered under the magnetic field increased by approximately 30 %. For the first time, first-principles calculations revealed how the synergistic effect of magnetic Ni doping and magnetic field application improved the mechanical and electronic properties of (Cu, Ni)6Sn5 IMC. These findings provided essential insights into the microstructural evolution of Sn-based magnetic solders under magnetic fields and contributed to the development of magnetic field-assisted soldering and the design of magnetic solder materials. |
| format | Article |
| id | doaj-art-d78f75e3570a46d98e5802e04e976701 |
| institution | DOAJ |
| issn | 0264-1275 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj-art-d78f75e3570a46d98e5802e04e9767012025-08-20T03:22:04ZengElsevierMaterials & Design0264-12752025-07-0125511415810.1016/j.matdes.2025.114158Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni soldersChuan-jiang Wu0Liang Zhang1Yu-hao Chen2Xin-quan Yu3Quan-Bin Lu4Wei-min Long5School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361000, ChinaSchool of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361000, China; State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China; Corresponding authors.School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361000, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China; Corresponding authors.Magnetic-field-assisted soldering offered a promising approach for achieving high-reliability interconnects in space applications. In this study, Sn58Bi solder and its composites doped with 0.6 wt% Ni nanoparticles (NPs) or microparticles (MPs) were investigated to elucidate the effects of magnetic fields on the behavior of magnetic solders, with particular focus on microstructural evolution, grain orientation, and mechanical performance. The classical lamellar eutectic structure was transformed into a honeycomb-like morphology under the applied magnetic field, accompanied by an increased dislocation density. Meanwhile, the magnetic field suppressed Ni particle agglomeration and promoted the precipitation of fine (Cu, Ni)6Sn5 grains between the Sn and Bi phases, which produced a pinning effect. It also inhibited intermetallic compounds (IMC) layer growth, refined the IMC grains, and preserved their orientation. Consequently, the shear strength of joints soldered under the magnetic field increased by approximately 30 %. For the first time, first-principles calculations revealed how the synergistic effect of magnetic Ni doping and magnetic field application improved the mechanical and electronic properties of (Cu, Ni)6Sn5 IMC. These findings provided essential insights into the microstructural evolution of Sn-based magnetic solders under magnetic fields and contributed to the development of magnetic field-assisted soldering and the design of magnetic solder materials.http://www.sciencedirect.com/science/article/pii/S0264127525005787Magnetic solderMagnetic fieldPrecipitationFirst-principles |
| spellingShingle | Chuan-jiang Wu Liang Zhang Yu-hao Chen Xin-quan Yu Quan-Bin Lu Wei-min Long Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders Materials & Design Magnetic solder Magnetic field Precipitation First-principles |
| title | Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders |
| title_full | Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders |
| title_fullStr | Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders |
| title_full_unstemmed | Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders |
| title_short | Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders |
| title_sort | effect of magnetic field on precipitation kinetics and shear strength of sn58bi ni solders |
| topic | Magnetic solder Magnetic field Precipitation First-principles |
| url | http://www.sciencedirect.com/science/article/pii/S0264127525005787 |
| work_keys_str_mv | AT chuanjiangwu effectofmagneticfieldonprecipitationkineticsandshearstrengthofsn58binisolders AT liangzhang effectofmagneticfieldonprecipitationkineticsandshearstrengthofsn58binisolders AT yuhaochen effectofmagneticfieldonprecipitationkineticsandshearstrengthofsn58binisolders AT xinquanyu effectofmagneticfieldonprecipitationkineticsandshearstrengthofsn58binisolders AT quanbinlu effectofmagneticfieldonprecipitationkineticsandshearstrengthofsn58binisolders AT weiminlong effectofmagneticfieldonprecipitationkineticsandshearstrengthofsn58binisolders |