Measurement and Analysis of Interconnects’ Resonance and Signal/Power Integrity Degradation in Glass Packages
In this article, resonance phenomena of high-speed interconnects and power delivery networks in glass packages are measured and analyzed. The resonances are generated in the interconnection by the physical dimension, cancelation of reactance components, and modes. When the resonances are generated i...
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| Main Author: | |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/1/112 |
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