Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 &#x00D7; 12 switching ports. The challenges in packaging N<sup> 2</sup> electrical and 2N optical interconnections are...

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Bibliographic Details
Main Authors: How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien
Format: Article
Language:English
Published: IEEE 2017-01-01
Series:IEEE Photonics Journal
Subjects:
Flip chip
interposer
micro-electro-mechanical system (MEMS) packaging
optical switches
silicon photonics.
Online Access:https://ieeexplore.ieee.org/document/7927713/
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https://ieeexplore.ieee.org/document/7927713/

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