Solid-state compound phase formation of TiSi2 thin films under stress

Different stress situations were created on an Si(100) wafer by depositing either Si3N4 or SiO2 thin films on the back side. Si3N4 has a different thermal expansion coefficient from that of SiO2. A thin Ti film was then deposited on the front side of the Si wafer. The structures were then annealed a...

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Main Authors: C. Theron, N. Mokoena, O. Ndwandwe
Format: Article
Language:English
Published: Academy of Science of South Africa 2009-11-01
Series:South African Journal of Science
Online Access:https://sajs.co.za/article/view/10227
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author C. Theron
N. Mokoena
O. Ndwandwe
author_facet C. Theron
N. Mokoena
O. Ndwandwe
author_sort C. Theron
collection DOAJ
description Different stress situations were created on an Si(100) wafer by depositing either Si3N4 or SiO2 thin films on the back side. Si3N4 has a different thermal expansion coefficient from that of SiO2. A thin Ti film was then deposited on the front side of the Si wafer. The structures were then annealed at various high temperatures for different periods of time. Real-time Rutherford backscattering spectrometry, as well as sample curvature measurements, were used to characterise the samples. Different reaction rates were found between Si3N4-deposited samples and SiO2-deposited samples.
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series South African Journal of Science
spelling doaj-art-d5831c36c3a844c8b57e7c17dfaf23d02025-08-20T02:25:59ZengAcademy of Science of South AfricaSouth African Journal of Science1996-74892009-11-0110511/124404448408Solid-state compound phase formation of TiSi2 thin films under stressC. Theron0N. Mokoena1O. Ndwandwe2Department of Physics, University of Pretoria, Pretoria 0002, South Africa.Department of Physics and Engineering, University of Zululand, Private Bag X1001, KwaDlangezwa 3886, South Africa. Reactor Fuel Engineering Group, Koeberg Nuclear Power Station, Private Bag X10, Kernkrag 7440, South Africa.Department of Physics and Engineering, University of Zululand, Private Bag X1001, KwaDlangezwa 3886, South Africa.Different stress situations were created on an Si(100) wafer by depositing either Si3N4 or SiO2 thin films on the back side. Si3N4 has a different thermal expansion coefficient from that of SiO2. A thin Ti film was then deposited on the front side of the Si wafer. The structures were then annealed at various high temperatures for different periods of time. Real-time Rutherford backscattering spectrometry, as well as sample curvature measurements, were used to characterise the samples. Different reaction rates were found between Si3N4-deposited samples and SiO2-deposited samples.https://sajs.co.za/article/view/10227
spellingShingle C. Theron
N. Mokoena
O. Ndwandwe
Solid-state compound phase formation of TiSi2 thin films under stress
South African Journal of Science
title Solid-state compound phase formation of TiSi2 thin films under stress
title_full Solid-state compound phase formation of TiSi2 thin films under stress
title_fullStr Solid-state compound phase formation of TiSi2 thin films under stress
title_full_unstemmed Solid-state compound phase formation of TiSi2 thin films under stress
title_short Solid-state compound phase formation of TiSi2 thin films under stress
title_sort solid state compound phase formation of tisi2 thin films under stress
url https://sajs.co.za/article/view/10227
work_keys_str_mv AT ctheron solidstatecompoundphaseformationoftisi2thinfilmsunderstress
AT nmokoena solidstatecompoundphaseformationoftisi2thinfilmsunderstress
AT ondwandwe solidstatecompoundphaseformationoftisi2thinfilmsunderstress