Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs
By showing a packaged device model with 2×2 chips, the effects of packaging material, device height, chip spacing, thermal conductivity, and viscosity of silicone oil on temperature distribution of deep ultraviolet (UV) light-emitting diodes (LEDs) were investigated by finite element simulation. The...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2023-01-01
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| Series: | International Journal of Photoenergy |
| Online Access: | http://dx.doi.org/10.1155/2023/8012350 |
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| _version_ | 1849683592150515712 |
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| author | Zhenghao Xia Zuojie Wen Bingqian Li Fei Wang Daming Zhang |
| author_facet | Zhenghao Xia Zuojie Wen Bingqian Li Fei Wang Daming Zhang |
| author_sort | Zhenghao Xia |
| collection | DOAJ |
| description | By showing a packaged device model with 2×2 chips, the effects of packaging material, device height, chip spacing, thermal conductivity, and viscosity of silicone oil on temperature distribution of deep ultraviolet (UV) light-emitting diodes (LEDs) were investigated by finite element simulation. The results showed that similar temperature distributions in the horizontal and vertical directions were obtained using different packaging materials including gas, solid, and liquid. The lowest maximum temperature (131.7°C) was obtained with liquid packaging compared to the gas packaging (140.8°C) and solid packing (132.5°C). Accompanied by increasing the device height, the maximum temperature of the liquid packaging structure revealed a more significant drop compared to solid packaging. However, that of gas packaging exhibited a rise and saturation. Larger chip spacing and higher thermal conductivity of silicone oil will dramatically reduce the maximum temperature of the liquid packaging device, and a lower maximum temperature and more uniform temperature distribution were obtained by using a lower viscosity packaging material. Therefore, considering the feasibility of the device process, appropriate liquid packaging structures can be optimized, and the maximum temperature of the liquid packaging structure of 102.8°C has been achieved. Liquid packaging may have a certain impact on the reliability of device sealing due to the current immature technology. For high-power light sources, there may also be a certain impact on their lifespan. |
| format | Article |
| id | doaj-art-d3f0dc33782b444293601c61fbddb4b7 |
| institution | DOAJ |
| issn | 1687-529X |
| language | English |
| publishDate | 2023-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Photoenergy |
| spelling | doaj-art-d3f0dc33782b444293601c61fbddb4b72025-08-20T03:23:47ZengWileyInternational Journal of Photoenergy1687-529X2023-01-01202310.1155/2023/8012350Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDsZhenghao Xia0Zuojie Wen1Bingqian Li2Fei Wang3Daming Zhang4State Key Laboratory of Integrated OptoelectronicsSchool of Applied Physics and MaterialsSchool of Applied Physics and MaterialsState Key Laboratory of Integrated OptoelectronicsState Key Laboratory of Integrated OptoelectronicsBy showing a packaged device model with 2×2 chips, the effects of packaging material, device height, chip spacing, thermal conductivity, and viscosity of silicone oil on temperature distribution of deep ultraviolet (UV) light-emitting diodes (LEDs) were investigated by finite element simulation. The results showed that similar temperature distributions in the horizontal and vertical directions were obtained using different packaging materials including gas, solid, and liquid. The lowest maximum temperature (131.7°C) was obtained with liquid packaging compared to the gas packaging (140.8°C) and solid packing (132.5°C). Accompanied by increasing the device height, the maximum temperature of the liquid packaging structure revealed a more significant drop compared to solid packaging. However, that of gas packaging exhibited a rise and saturation. Larger chip spacing and higher thermal conductivity of silicone oil will dramatically reduce the maximum temperature of the liquid packaging device, and a lower maximum temperature and more uniform temperature distribution were obtained by using a lower viscosity packaging material. Therefore, considering the feasibility of the device process, appropriate liquid packaging structures can be optimized, and the maximum temperature of the liquid packaging structure of 102.8°C has been achieved. Liquid packaging may have a certain impact on the reliability of device sealing due to the current immature technology. For high-power light sources, there may also be a certain impact on their lifespan.http://dx.doi.org/10.1155/2023/8012350 |
| spellingShingle | Zhenghao Xia Zuojie Wen Bingqian Li Fei Wang Daming Zhang Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs International Journal of Photoenergy |
| title | Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs |
| title_full | Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs |
| title_fullStr | Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs |
| title_full_unstemmed | Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs |
| title_short | Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs |
| title_sort | temperature distribution research on liquid packaging structure of deep uv leds |
| url | http://dx.doi.org/10.1155/2023/8012350 |
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