Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique
In this study, rupture of notched SENT specimens fabricated from a novel lead-free solder alloy is investigated. The lead-free solder alloy, focused on in this study, is particularly used as interconnect material in power modules of electric vehicles. Its commercial denomination is InnoLot and it c...
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| Format: | Article |
| Language: | English |
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Publishing House for Science and Technology
2020-03-01
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| Series: | Vietnam Journal of Mechanics |
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| Online Access: | https://vjs.ac.vn/index.php/vjmech/article/view/14397 |
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| author | Tao Quang Bang Nguyen Van Thien An Lahouari Benabou Nguyen Xuan Hung |
| author_facet | Tao Quang Bang Nguyen Van Thien An Lahouari Benabou Nguyen Xuan Hung |
| author_sort | Tao Quang Bang |
| collection | DOAJ |
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In this study, rupture of notched SENT specimens fabricated from a novel lead-free solder alloy is investigated. The lead-free solder alloy, focused on in this study, is particularly used as interconnect material in power modules of electric vehicles. Its commercial denomination is InnoLot and it can be used in harsh environments thanks to its improved reliability. Up to now, studies on their resistance to rupture remain relatively limited. Yet the comprehension of fracture behavior is essential for the correct design of the electronic packages which must be robust against fatigue and vibrations loads. The tests are performed with the help of a micro-tensile testing machine equipped with an optical system for full-field measurements with Digital Image Correlation. The images are taken at successive steps of deformation and the displacement field is measured in a region of interest which is the singularity dominated zone surrounding the plastic zone at the crack tip. The procedure consists then in comparing the measured field with the theoretical field given by the Williams' solution. The stress intensity factor is calculated by fitting the analytical fields to the experimental data. The effects of the size and shape of the zone of data collection, as well as that of the number of terms considered in the Williams's expansion series, are examined in the study. A method is also proposed for the automatic crack tip detection. From these finding, it is easy to predict the crack propagation and failure mechanism of solder joint. In addition, the theoretical solution of displacement, given by the Williams series, is compared with measurements to identify the coefficients of these series, including the stress intensity factor. Finally, a 5-order truncation of the Williams series seems sufficient to obtain a correct estimate of the stress intensity factor.
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| format | Article |
| id | doaj-art-d3effc7dffcc474ca164093d0c8ab9cb |
| institution | DOAJ |
| issn | 0866-7136 2815-5882 |
| language | English |
| publishDate | 2020-03-01 |
| publisher | Publishing House for Science and Technology |
| record_format | Article |
| series | Vietnam Journal of Mechanics |
| spelling | doaj-art-d3effc7dffcc474ca164093d0c8ab9cb2025-08-20T03:04:44ZengPublishing House for Science and TechnologyVietnam Journal of Mechanics0866-71362815-58822020-03-0142110.15625/0866-7136/14397Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC techniqueTao Quang Bang0Nguyen Van Thien An1Lahouari Benabou2Nguyen Xuan Hung3Danang University of Technology, University of Danang, VietnamDanang University of Technology, University of Danang, VietnamLISV, University of Versailles Saint Quentin en Yvelines, University of Paris Saclay, FranceCIRTech Institute, Ho Chi Minh City University of Technology (HUTECH), Vietnam In this study, rupture of notched SENT specimens fabricated from a novel lead-free solder alloy is investigated. The lead-free solder alloy, focused on in this study, is particularly used as interconnect material in power modules of electric vehicles. Its commercial denomination is InnoLot and it can be used in harsh environments thanks to its improved reliability. Up to now, studies on their resistance to rupture remain relatively limited. Yet the comprehension of fracture behavior is essential for the correct design of the electronic packages which must be robust against fatigue and vibrations loads. The tests are performed with the help of a micro-tensile testing machine equipped with an optical system for full-field measurements with Digital Image Correlation. The images are taken at successive steps of deformation and the displacement field is measured in a region of interest which is the singularity dominated zone surrounding the plastic zone at the crack tip. The procedure consists then in comparing the measured field with the theoretical field given by the Williams' solution. The stress intensity factor is calculated by fitting the analytical fields to the experimental data. The effects of the size and shape of the zone of data collection, as well as that of the number of terms considered in the Williams's expansion series, are examined in the study. A method is also proposed for the automatic crack tip detection. From these finding, it is easy to predict the crack propagation and failure mechanism of solder joint. In addition, the theoretical solution of displacement, given by the Williams series, is compared with measurements to identify the coefficients of these series, including the stress intensity factor. Finally, a 5-order truncation of the Williams series seems sufficient to obtain a correct estimate of the stress intensity factor. https://vjs.ac.vn/index.php/vjmech/article/view/14397lead-free solderdigital image correlationplastic zonefracture |
| spellingShingle | Tao Quang Bang Nguyen Van Thien An Lahouari Benabou Nguyen Xuan Hung Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique Vietnam Journal of Mechanics lead-free solder digital image correlation plastic zone fracture |
| title | Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique |
| title_full | Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique |
| title_fullStr | Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique |
| title_full_unstemmed | Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique |
| title_short | Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique |
| title_sort | experimental and numerical investigations of full field strain measurement and fracture parameter of lead free solder using dic technique |
| topic | lead-free solder digital image correlation plastic zone fracture |
| url | https://vjs.ac.vn/index.php/vjmech/article/view/14397 |
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