Phone‐nomenon 2.0: A compact thermal model for smartphones
Abstract This paper presents a compact thermal model for smartphones, Phone‐nomenon 2.0, to predict the thermal behavior of smartphones. In the beginning, non‐linearities of internal and external heat transfer mechanisms of smartphones and a compact thermal model for these non‐linearities have been...
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| Format: | Article |
| Language: | English |
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Wiley
2023-03-01
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| Series: | IET Computers & Digital Techniques |
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| Online Access: | https://doi.org/10.1049/cdt2.12052 |
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| author | Yu‐Min Lee Hong‐Wen Chiou Shinyu Shiau Chi‐Wen Pan Shih‐Hung Ting |
| author_facet | Yu‐Min Lee Hong‐Wen Chiou Shinyu Shiau Chi‐Wen Pan Shih‐Hung Ting |
| author_sort | Yu‐Min Lee |
| collection | DOAJ |
| description | Abstract This paper presents a compact thermal model for smartphones, Phone‐nomenon 2.0, to predict the thermal behavior of smartphones. In the beginning, non‐linearities of internal and external heat transfer mechanisms of smartphones and a compact thermal model for these non‐linearities have been studied and proposed. Then, an iterative simulation procedure to handle these non‐linearities was developed, and the basic simulation framework which is one option in Phone‐nomenon 2.0 was established and we call it Phone‐nomenon.Iter. Finally, the linearisation approach was applied, and model order reduction techniques to enhance and speed up the basic framework were employed, and these two options Phone‐nomenon.Lin and Phone‐nomenon.LinMOR were named. Compared with a commercial tool, ANSYS Icepak, Phone‐nomenon.Iter can achieve two orders of magnitude speedup with the maximum error being less than 1.90% for steady‐state simulations and three orders of magnitude speedup with the temperature difference being less than 0.65°C for transient simulations. In addition, the speedup of Phone‐nomenon.Lin over Phone‐nomenon.Iter can be at least 4.22× and 3.26× for steady‐state and transient simulations, respectively. Moreover, the speedup of Phone‐nomenon.LinMOR over Phone‐nomenon.Lin is at least 2.57×. |
| format | Article |
| id | doaj-art-d34590afba4a437d98f3e9307e24673c |
| institution | OA Journals |
| issn | 1751-8601 1751-861X |
| language | English |
| publishDate | 2023-03-01 |
| publisher | Wiley |
| record_format | Article |
| series | IET Computers & Digital Techniques |
| spelling | doaj-art-d34590afba4a437d98f3e9307e24673c2025-08-20T02:19:51ZengWileyIET Computers & Digital Techniques1751-86011751-861X2023-03-01172435910.1049/cdt2.12052Phone‐nomenon 2.0: A compact thermal model for smartphonesYu‐Min Lee0Hong‐Wen Chiou1Shinyu Shiau2Chi‐Wen Pan3Shih‐Hung Ting4Department of Electronics and Electrical Engineering National Yang Ming Chiao Tung University Hsinchu TaiwanInstitute of Communications Engineering National Yang Ming Chiao Tung University Hsinchu TaiwanElectrical and Computer Engineering Carnegie Mellon University Pittsburgh Pennsylvania USAInstitute of Communications Engineering National Yang Ming Chiao Tung University Hsinchu TaiwanInstitute of Communications Engineering National Yang Ming Chiao Tung University Hsinchu TaiwanAbstract This paper presents a compact thermal model for smartphones, Phone‐nomenon 2.0, to predict the thermal behavior of smartphones. In the beginning, non‐linearities of internal and external heat transfer mechanisms of smartphones and a compact thermal model for these non‐linearities have been studied and proposed. Then, an iterative simulation procedure to handle these non‐linearities was developed, and the basic simulation framework which is one option in Phone‐nomenon 2.0 was established and we call it Phone‐nomenon.Iter. Finally, the linearisation approach was applied, and model order reduction techniques to enhance and speed up the basic framework were employed, and these two options Phone‐nomenon.Lin and Phone‐nomenon.LinMOR were named. Compared with a commercial tool, ANSYS Icepak, Phone‐nomenon.Iter can achieve two orders of magnitude speedup with the maximum error being less than 1.90% for steady‐state simulations and three orders of magnitude speedup with the temperature difference being less than 0.65°C for transient simulations. In addition, the speedup of Phone‐nomenon.Lin over Phone‐nomenon.Iter can be at least 4.22× and 3.26× for steady‐state and transient simulations, respectively. Moreover, the speedup of Phone‐nomenon.LinMOR over Phone‐nomenon.Lin is at least 2.57×.https://doi.org/10.1049/cdt2.12052linearisationmodel order reductionsmartphonessystem levelthermal simulation |
| spellingShingle | Yu‐Min Lee Hong‐Wen Chiou Shinyu Shiau Chi‐Wen Pan Shih‐Hung Ting Phone‐nomenon 2.0: A compact thermal model for smartphones IET Computers & Digital Techniques linearisation model order reduction smartphones system level thermal simulation |
| title | Phone‐nomenon 2.0: A compact thermal model for smartphones |
| title_full | Phone‐nomenon 2.0: A compact thermal model for smartphones |
| title_fullStr | Phone‐nomenon 2.0: A compact thermal model for smartphones |
| title_full_unstemmed | Phone‐nomenon 2.0: A compact thermal model for smartphones |
| title_short | Phone‐nomenon 2.0: A compact thermal model for smartphones |
| title_sort | phone nomenon 2 0 a compact thermal model for smartphones |
| topic | linearisation model order reduction smartphones system level thermal simulation |
| url | https://doi.org/10.1049/cdt2.12052 |
| work_keys_str_mv | AT yuminlee phonenomenon20acompactthermalmodelforsmartphones AT hongwenchiou phonenomenon20acompactthermalmodelforsmartphones AT shinyushiau phonenomenon20acompactthermalmodelforsmartphones AT chiwenpan phonenomenon20acompactthermalmodelforsmartphones AT shihhungting phonenomenon20acompactthermalmodelforsmartphones |