Novel 4H-SiC Double-Trench MOSFETs with Integrated Schottky Barrier and MOS-Channel Diodes for Enhanced Breakdown Voltage and Switching Characteristics
In this study, a novel silicon carbide (SiC) double-trench MOSFET (DT-MOS) combined Schottky barrier diode (SBD) and MOS-channel diode (MCD) is proposed and investigated using TCAD simulations. The integrated MCD helps inactivate the parasitic body diode when the device is utilized as a freewheeling...
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| Main Authors: | , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-06-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/15/12/946 |
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| Summary: | In this study, a novel silicon carbide (SiC) double-trench MOSFET (DT-MOS) combined Schottky barrier diode (SBD) and MOS-channel diode (MCD) is proposed and investigated using TCAD simulations. The integrated MCD helps inactivate the parasitic body diode when the device is utilized as a freewheeling diode, eliminating bipolar degradation. The adjustment of SBD position provides an alternative path for reverse conduction and mitigates the electric field distribution near the bottom source trench region. As a result of the Schottky contact adjustment, the reverse conduction characteristics are less influenced by the source oxide thickness, and the breakdown voltage (BV) is largely improved from 800 V to 1069 V. The gate-to-drain capacitance is much lower due to the removal of the bottom oxide, bringing an improvement to the turn-on switching rise time from 2.58 ns to 0.68 ns. These optimized performances indicate the proposed structure with both SBD and MCD has advantages in switching and breakdown characteristics. |
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| ISSN: | 2079-4991 |