Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent
With the increasing demand for thermal management in electronic devices and industrial systems, nanofluids have emerged as a research hotspot due to their superior thermal conductivity and heat transfer efficiency. Among them, CuO-H<sub>2</sub>O demonstrates excellent heat transfer perfo...
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| author | Junqiang Xu Zemin Shang Shan Qing |
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| description | With the increasing demand for thermal management in electronic devices and industrial systems, nanofluids have emerged as a research hotspot due to their superior thermal conductivity and heat transfer efficiency. Among them, CuO-H<sub>2</sub>O demonstrates excellent heat transfer performance due to its high thermal conductivity, Fe<sub>3</sub>O<sub>4</sub>-H<sub>2</sub>O offers potential for further optimization by combining thermal and magnetic properties, and Al<sub>2</sub>O<sub>3</sub>-H<sub>2</sub>O exhibits strong chemical stability, making it suitable for a wide range of applications. These three nanofluids are representative in terms of particle dispersibility, thermal conductivity, and physical properties, providing a comprehensive perspective on the impact of nanofluids on microchannel heat exchangers. This study investigates the heat transfer performance and flow characteristics of various types and volume fractions of nanofluids in microchannel heat exchangers. The results reveal that with increasing flow rates, the convective heat transfer coefficient and Nusselt number of nanofluids exhibit an approximately linear growth trend, primarily attributed to the turbulence enhancement effect caused by higher flow rates. Among the tested nanofluids, CuO-H<sub>2</sub>O demonstrates the best performance, achieving a 4.89% improvement in the heat transfer coefficient and a 1.64% increase in the Nusselt number compared to pure water. Moreover, CuO-H<sub>2</sub>O nanofluid significantly reduces wall temperatures, showcasing its superior thermal management capabilities. In comparison, the performance of Al<sub>2</sub>O<sub>3</sub>-H<sub>2</sub>O and Fe<sub>3</sub>O<sub>4</sub>-H<sub>2</sub>O nanofluids is slightly inferior. In terms of flow characteristics, the pressure drop and friction factor of nanofluids exhibit nonlinear variations with increasing flow rates. High-concentration CuO-H<sub>2</sub>O nanofluid shows a substantial pressure drop, with an increase of 7.33% compared to pure water, but its friction factor remains relatively low and stabilizes at higher flow rates. Additionally, increasing the nanoparticle volume fraction enhances the convective heat transfer performance; however, excessively high concentrations may suppress heat transfer efficiency due to increased viscosity, leading to a decrease in the Nusselt number. Overall, CuO-H<sub>2</sub>O nanofluid exhibits excellent thermal conductivity and flow optimization potential, making it a promising candidate for efficient thermal management in MCHEs. However, its application at high concentrations may face challenges related to increased flow resistance. These findings provide valuable theoretical support and optimization directions for the development of advanced thermal management technologies. |
| format | Article |
| id | doaj-art-d0e62150b90044ed86af92927d5b16cb |
| institution | Kabale University |
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| spelling | doaj-art-d0e62150b90044ed86af92927d5b16cb2025-01-10T13:17:24ZengMDPI AGEnergies1996-10732025-01-0118120410.3390/en18010204Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on FluentJunqiang Xu0Zemin Shang1Shan Qing2Department of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, ChinaSchool of Mechanical and Electronic Control Engineering, Beijing Jiaotong University, Beijing 100044, ChinaDepartment of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, ChinaWith the increasing demand for thermal management in electronic devices and industrial systems, nanofluids have emerged as a research hotspot due to their superior thermal conductivity and heat transfer efficiency. Among them, CuO-H<sub>2</sub>O demonstrates excellent heat transfer performance due to its high thermal conductivity, Fe<sub>3</sub>O<sub>4</sub>-H<sub>2</sub>O offers potential for further optimization by combining thermal and magnetic properties, and Al<sub>2</sub>O<sub>3</sub>-H<sub>2</sub>O exhibits strong chemical stability, making it suitable for a wide range of applications. These three nanofluids are representative in terms of particle dispersibility, thermal conductivity, and physical properties, providing a comprehensive perspective on the impact of nanofluids on microchannel heat exchangers. This study investigates the heat transfer performance and flow characteristics of various types and volume fractions of nanofluids in microchannel heat exchangers. The results reveal that with increasing flow rates, the convective heat transfer coefficient and Nusselt number of nanofluids exhibit an approximately linear growth trend, primarily attributed to the turbulence enhancement effect caused by higher flow rates. Among the tested nanofluids, CuO-H<sub>2</sub>O demonstrates the best performance, achieving a 4.89% improvement in the heat transfer coefficient and a 1.64% increase in the Nusselt number compared to pure water. Moreover, CuO-H<sub>2</sub>O nanofluid significantly reduces wall temperatures, showcasing its superior thermal management capabilities. In comparison, the performance of Al<sub>2</sub>O<sub>3</sub>-H<sub>2</sub>O and Fe<sub>3</sub>O<sub>4</sub>-H<sub>2</sub>O nanofluids is slightly inferior. In terms of flow characteristics, the pressure drop and friction factor of nanofluids exhibit nonlinear variations with increasing flow rates. High-concentration CuO-H<sub>2</sub>O nanofluid shows a substantial pressure drop, with an increase of 7.33% compared to pure water, but its friction factor remains relatively low and stabilizes at higher flow rates. Additionally, increasing the nanoparticle volume fraction enhances the convective heat transfer performance; however, excessively high concentrations may suppress heat transfer efficiency due to increased viscosity, leading to a decrease in the Nusselt number. Overall, CuO-H<sub>2</sub>O nanofluid exhibits excellent thermal conductivity and flow optimization potential, making it a promising candidate for efficient thermal management in MCHEs. However, its application at high concentrations may face challenges related to increased flow resistance. These findings provide valuable theoretical support and optimization directions for the development of advanced thermal management technologies.https://www.mdpi.com/1996-1073/18/1/204micro heat exchangernanofluidnumerical simulationflow heat transfer |
| spellingShingle | Junqiang Xu Zemin Shang Shan Qing Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent Energies micro heat exchanger nanofluid numerical simulation flow heat transfer |
| title | Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent |
| title_full | Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent |
| title_fullStr | Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent |
| title_full_unstemmed | Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent |
| title_short | Thermal Performance Analysis of Nanofluids for Heat Dissipation Based on Fluent |
| title_sort | thermal performance analysis of nanofluids for heat dissipation based on fluent |
| topic | micro heat exchanger nanofluid numerical simulation flow heat transfer |
| url | https://www.mdpi.com/1996-1073/18/1/204 |
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