Multilayer Metallization Systems of Submicron Integrated Circuits
The creation of a multilevel system of interconnections in submicron integrated circuits makes it possible to reduce the electrical resistance of conductive tracks, parasitic capacitance between conductors, and increase the speed of microelectronic devices. It is proposed to form a transverse profil...
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| Main Author: | |
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| Format: | Article |
| Language: | Russian |
| Published: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2022-12-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/3498 |
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