Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs
Abstract This paper investigates the climatic reliability of realistic PCBA component geometries soldered using reflow process, from the perspective of the interaction between component design parameters, reflow residue and humidity. The study was carried out using electrochemical characterization,...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-07-01
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| Series: | Scientific Reports |
| Subjects: | |
| Online Access: | https://doi.org/10.1038/s41598-025-05969-z |
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