Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs
Abstract This paper investigates the climatic reliability of realistic PCBA component geometries soldered using reflow process, from the perspective of the interaction between component design parameters, reflow residue and humidity. The study was carried out using electrochemical characterization,...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-07-01
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| Series: | Scientific Reports |
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| Online Access: | https://doi.org/10.1038/s41598-025-05969-z |
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| author | Anish Rao Lakkaraju Helene Conseil-Gudla Mike Bixenman Rajan Ambat |
| author_facet | Anish Rao Lakkaraju Helene Conseil-Gudla Mike Bixenman Rajan Ambat |
| author_sort | Anish Rao Lakkaraju |
| collection | DOAJ |
| description | Abstract This paper investigates the climatic reliability of realistic PCBA component geometries soldered using reflow process, from the perspective of the interaction between component design parameters, reflow residue and humidity. The study was carried out using electrochemical characterization, electron microscopy, and X-ray imaging. Custom-designed PCBA test cards with dummy components have been exposed to harsh climate after reflow soldering. A methodology of combining Leakage current and electrochemical impedance measurements has been used to characterize PCBA performance. Changes in flux morphology and any associated negative effects as a function of humidity interaction have been connected to component connector design parameters, to achieve a holistic understanding of flux system-component suitability and humidity interaction. |
| format | Article |
| id | doaj-art-cdec3423d72648aab0b53e6987df1821 |
| institution | Kabale University |
| issn | 2045-2322 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Scientific Reports |
| spelling | doaj-art-cdec3423d72648aab0b53e6987df18212025-08-20T03:38:15ZengNature PortfolioScientific Reports2045-23222025-07-0115111610.1038/s41598-025-05969-zReflow solder flux residue and humidity interaction: investigation using real PCBA component designsAnish Rao Lakkaraju0Helene Conseil-Gudla1Mike Bixenman2Rajan Ambat3Center for Electronics Corrosion (CELCORR), Technical University of DenmarkCenter for Electronics Corrosion (CELCORR), Technical University of DenmarkMagnalytix IncCenter for Electronics Corrosion (CELCORR), Technical University of DenmarkAbstract This paper investigates the climatic reliability of realistic PCBA component geometries soldered using reflow process, from the perspective of the interaction between component design parameters, reflow residue and humidity. The study was carried out using electrochemical characterization, electron microscopy, and X-ray imaging. Custom-designed PCBA test cards with dummy components have been exposed to harsh climate after reflow soldering. A methodology of combining Leakage current and electrochemical impedance measurements has been used to characterize PCBA performance. Changes in flux morphology and any associated negative effects as a function of humidity interaction have been connected to component connector design parameters, to achieve a holistic understanding of flux system-component suitability and humidity interaction.https://doi.org/10.1038/s41598-025-05969-zCapacitorsClimatic reliabilityComponentsContaminationFluxPrinted circuit board assembly (PCBA) |
| spellingShingle | Anish Rao Lakkaraju Helene Conseil-Gudla Mike Bixenman Rajan Ambat Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs Scientific Reports Capacitors Climatic reliability Components Contamination Flux Printed circuit board assembly (PCBA) |
| title | Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs |
| title_full | Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs |
| title_fullStr | Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs |
| title_full_unstemmed | Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs |
| title_short | Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs |
| title_sort | reflow solder flux residue and humidity interaction investigation using real pcba component designs |
| topic | Capacitors Climatic reliability Components Contamination Flux Printed circuit board assembly (PCBA) |
| url | https://doi.org/10.1038/s41598-025-05969-z |
| work_keys_str_mv | AT anishraolakkaraju reflowsolderfluxresidueandhumidityinteractioninvestigationusingrealpcbacomponentdesigns AT heleneconseilgudla reflowsolderfluxresidueandhumidityinteractioninvestigationusingrealpcbacomponentdesigns AT mikebixenman reflowsolderfluxresidueandhumidityinteractioninvestigationusingrealpcbacomponentdesigns AT rajanambat reflowsolderfluxresidueandhumidityinteractioninvestigationusingrealpcbacomponentdesigns |