MONITORING OF IC ENCAPSULATION PROCESS
High reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the...
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Belarusian National Technical University
2015-03-01
|
| Series: | Приборы и методы измерений |
| Subjects: | |
| Online Access: | https://pimi.bntu.by/jour/article/view/25 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849404169741402112 |
|---|---|
| author | V. A. Saladukha V. S. Turtsevitch J. A. Solovjov I. I. Rubtsevitch A. F. Kerentsev A. A. Dovzhenko I. V. Chirko |
| author_facet | V. A. Saladukha V. S. Turtsevitch J. A. Solovjov I. I. Rubtsevitch A. F. Kerentsev A. A. Dovzhenko I. V. Chirko |
| author_sort | V. A. Saladukha |
| collection | DOAJ |
| description | High reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the conditions of contact welding and the instruments for complex measurements of parameters of the ambient environment of the encapsulation system has allowed to provide a continuous monitoring of the process parameters: welding current, temperature, dew point and relative humidity of an inert ambient environment. As the result of seam welding, increase of yield fitted in hermeticity over 99,0 % and decrease the moisture content inside the IC package to vol. 0,01–0,2 % has been reached. |
| format | Article |
| id | doaj-art-cdcd1878acf6416281389e4e656e12c9 |
| institution | Kabale University |
| issn | 2220-9506 2414-0473 |
| language | English |
| publishDate | 2015-03-01 |
| publisher | Belarusian National Technical University |
| record_format | Article |
| series | Приборы и методы измерений |
| spelling | doaj-art-cdcd1878acf6416281389e4e656e12c92025-08-20T03:37:05ZengBelarusian National Technical UniversityПриборы и методы измерений2220-95062414-04732015-03-010110310719MONITORING OF IC ENCAPSULATION PROCESSV. A. Saladukha0V. S. Turtsevitch1J. A. Solovjov2I. I. Rubtsevitch3A. F. Kerentsev4A. A. Dovzhenko5I. V. Chirko6«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. Минск«ИНТЕГРАЛ», г. МинскHigh reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the conditions of contact welding and the instruments for complex measurements of parameters of the ambient environment of the encapsulation system has allowed to provide a continuous monitoring of the process parameters: welding current, temperature, dew point and relative humidity of an inert ambient environment. As the result of seam welding, increase of yield fitted in hermeticity over 99,0 % and decrease the moisture content inside the IC package to vol. 0,01–0,2 % has been reached.https://pimi.bntu.by/jour/article/view/25integrated circuitsmoisturemonitoring |
| spellingShingle | V. A. Saladukha V. S. Turtsevitch J. A. Solovjov I. I. Rubtsevitch A. F. Kerentsev A. A. Dovzhenko I. V. Chirko MONITORING OF IC ENCAPSULATION PROCESS Приборы и методы измерений integrated circuits moisture monitoring |
| title | MONITORING OF IC ENCAPSULATION PROCESS |
| title_full | MONITORING OF IC ENCAPSULATION PROCESS |
| title_fullStr | MONITORING OF IC ENCAPSULATION PROCESS |
| title_full_unstemmed | MONITORING OF IC ENCAPSULATION PROCESS |
| title_short | MONITORING OF IC ENCAPSULATION PROCESS |
| title_sort | monitoring of ic encapsulation process |
| topic | integrated circuits moisture monitoring |
| url | https://pimi.bntu.by/jour/article/view/25 |
| work_keys_str_mv | AT vasaladukha monitoringoficencapsulationprocess AT vsturtsevitch monitoringoficencapsulationprocess AT jasolovjov monitoringoficencapsulationprocess AT iirubtsevitch monitoringoficencapsulationprocess AT afkerentsev monitoringoficencapsulationprocess AT aadovzhenko monitoringoficencapsulationprocess AT ivchirko monitoringoficencapsulationprocess |