Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology
Abstract Flexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment. Therefore, the development of encapsu...
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| Format: | Article |
| Language: | English |
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Wiley
2024-12-01
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| Series: | SmartMat |
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| Online Access: | https://doi.org/10.1002/smm2.1286 |
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| _version_ | 1850112557546733568 |
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| author | Guanran Wang Yu Duan |
| author_facet | Guanran Wang Yu Duan |
| author_sort | Guanran Wang |
| collection | DOAJ |
| description | Abstract Flexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment. Therefore, the development of encapsulation films with outstanding mechanical and encapsulation properties is the key to realizing wearable devices. This review provides an overview of the development of thin‐film encapsulation (TFE), the application of TFE in the field of optoelectronics, recent advances in the field of flexible encapsulation with TFE using atomic layer deposition technology, and an outlook on future trends in the field of flexible encapsulation with TFE using atomic layer deposition technology. |
| format | Article |
| id | doaj-art-ca1f1ea5992b4bf19efb0cee4d38e415 |
| institution | OA Journals |
| issn | 2688-819X |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Wiley |
| record_format | Article |
| series | SmartMat |
| spelling | doaj-art-ca1f1ea5992b4bf19efb0cee4d38e4152025-08-20T02:37:21ZengWileySmartMat2688-819X2024-12-0156n/an/a10.1002/smm2.1286Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technologyGuanran Wang0Yu Duan1State Key Laboratory of Integrated Optoelectronics, College of Electronic Science and Engineering Jilin University Changchun ChinaState Key Laboratory of Integrated Optoelectronics, College of Electronic Science and Engineering Jilin University Changchun ChinaAbstract Flexible, wearable electronics are the future of electronics. Although organic photovoltaic devices have the advantages of high efficiency, low cost, and flexibility, they face the problem of failure due to the effects of water vapor in the environment. Therefore, the development of encapsulation films with outstanding mechanical and encapsulation properties is the key to realizing wearable devices. This review provides an overview of the development of thin‐film encapsulation (TFE), the application of TFE in the field of optoelectronics, recent advances in the field of flexible encapsulation with TFE using atomic layer deposition technology, and an outlook on future trends in the field of flexible encapsulation with TFE using atomic layer deposition technology.https://doi.org/10.1002/smm2.1286atomic layer depositionflexible thin‐film encapsulationmolecular layer depositionorganic optoelectronic device |
| spellingShingle | Guanran Wang Yu Duan Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology SmartMat atomic layer deposition flexible thin‐film encapsulation molecular layer deposition organic optoelectronic device |
| title | Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology |
| title_full | Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology |
| title_fullStr | Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology |
| title_full_unstemmed | Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology |
| title_short | Efforts of implementing ultra‐flexible thin‐film encapsulation for optoelectronic devices based on atomic layer deposition technology |
| title_sort | efforts of implementing ultra flexible thin film encapsulation for optoelectronic devices based on atomic layer deposition technology |
| topic | atomic layer deposition flexible thin‐film encapsulation molecular layer deposition organic optoelectronic device |
| url | https://doi.org/10.1002/smm2.1286 |
| work_keys_str_mv | AT guanranwang effortsofimplementingultraflexiblethinfilmencapsulationforoptoelectronicdevicesbasedonatomiclayerdepositiontechnology AT yuduan effortsofimplementingultraflexiblethinfilmencapsulationforoptoelectronicdevicesbasedonatomiclayerdepositiontechnology |