Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties
Oxygen-free copper is widely used in power electronics, high-power modules, aerospace applications, and other advanced technologies. Currently, oxygen-free copper is primarily produced via phosphorus deoxidation, which negatively impacts the electrical and mechanical properties, as well as the adhes...
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Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425013444 |
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| author | Chu Cheng Yan-Shuo Feng Ming-Yu Li Hai-Tao Liu Meng-Xin Wang Ling-Liang Zhang Tao Huang Xiao-Wen Peng Zhi-He Dou Hui-Wen Guo Ke-Xing Song |
| author_facet | Chu Cheng Yan-Shuo Feng Ming-Yu Li Hai-Tao Liu Meng-Xin Wang Ling-Liang Zhang Tao Huang Xiao-Wen Peng Zhi-He Dou Hui-Wen Guo Ke-Xing Song |
| author_sort | Chu Cheng |
| collection | DOAJ |
| description | Oxygen-free copper is widely used in power electronics, high-power modules, aerospace applications, and other advanced technologies. Currently, oxygen-free copper is primarily produced via phosphorus deoxidation, which negatively impacts the electrical and mechanical properties, as well as the adhesion of the high-temperature oxide layer, thereby limiting the broader application of oxygen-free copper. In order to overcome the negative effects of phosphorus deoxidation in preparation of oxygen-free copper, it is proposed to replace phosphorus deoxidation with boron to eliminate the harm of phosphorus deoxidation in preparation of oxygen-free copper.This study investigates the production of oxygen-free copper using boron deoxidation for ceramic copper-chad plates, focusing on the deoxidation behavior of boron in copper melts and the influence of residual boron on the microstructure and properties of copper. The results show that boron can reduce the oxygen content in copper from 643 ppm to below 10 ppm. Boron primarily removes oxygen from [Cu2O] in the Cu–B–O melt, and the relationship between oxygen and boron concentrations in copper follows the Boltzmann model. As boron content increases in oxygen-free copper after deoxidation, the average grain size and electrical conductivity decrease. The relationship between average grain size and boron content adheres to the Boltzmann model, while the relationship between conductivity and boron content follows a logistic model. Tensile strength and elongation of copper initially increase and then decrease; the fracture mode of copper shifts from dimple fracture to brittle fracture and, ultimately, to a mixed dimple-brittle fracture. When the oxygen content of copper is 10 ppm and the residual boron content is 150 ppm, the comprehensive properties of oxygen-free copper are the best, the tensile strength is 156.7 MPa, the elongation is 41.58 %, and the conductivity is 97.98 IACS%. Boron enhances copper's strength via solid solution-strengthening as an interstitial element. |
| format | Article |
| id | doaj-art-ca16fbcbbe584081ae17094661833124 |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-ca16fbcbbe584081ae170946618331242025-08-20T01:57:12ZengElsevierJournal of Materials Research and Technology2238-78542025-05-01369529953810.1016/j.jmrt.2025.05.188Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material propertiesChu Cheng0Yan-Shuo Feng1Ming-Yu Li2Hai-Tao Liu3Meng-Xin Wang4Ling-Liang Zhang5Tao Huang6Xiao-Wen Peng7Zhi-He Dou8Hui-Wen Guo9Ke-Xing Song10School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China; Henan Key Laboratory of Non-ferrous Materials Science & Processing Technology, Henan University of Science and Technology, Luoyang, 471003, China; Provincial and Ministerial Co-construction Collaborative Innovation Center of Nonferrous New Materials and Advanced Processing Technology, Luoyang, 471023, China; Corresponding author. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China.School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaKey Laboratory of Ecological Utilization of Multi-metal Intergrown Ores of Ministry of Education, Northeastern University, Shenyang, 110819, ChinaChinalco Luoyang Copper Processing Co., Ltd, Luoyang, 471039, ChinaHenan Key Laboratory of Advanced Conductor Materials, Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450002, China; Corresponding author.Oxygen-free copper is widely used in power electronics, high-power modules, aerospace applications, and other advanced technologies. Currently, oxygen-free copper is primarily produced via phosphorus deoxidation, which negatively impacts the electrical and mechanical properties, as well as the adhesion of the high-temperature oxide layer, thereby limiting the broader application of oxygen-free copper. In order to overcome the negative effects of phosphorus deoxidation in preparation of oxygen-free copper, it is proposed to replace phosphorus deoxidation with boron to eliminate the harm of phosphorus deoxidation in preparation of oxygen-free copper.This study investigates the production of oxygen-free copper using boron deoxidation for ceramic copper-chad plates, focusing on the deoxidation behavior of boron in copper melts and the influence of residual boron on the microstructure and properties of copper. The results show that boron can reduce the oxygen content in copper from 643 ppm to below 10 ppm. Boron primarily removes oxygen from [Cu2O] in the Cu–B–O melt, and the relationship between oxygen and boron concentrations in copper follows the Boltzmann model. As boron content increases in oxygen-free copper after deoxidation, the average grain size and electrical conductivity decrease. The relationship between average grain size and boron content adheres to the Boltzmann model, while the relationship between conductivity and boron content follows a logistic model. Tensile strength and elongation of copper initially increase and then decrease; the fracture mode of copper shifts from dimple fracture to brittle fracture and, ultimately, to a mixed dimple-brittle fracture. When the oxygen content of copper is 10 ppm and the residual boron content is 150 ppm, the comprehensive properties of oxygen-free copper are the best, the tensile strength is 156.7 MPa, the elongation is 41.58 %, and the conductivity is 97.98 IACS%. Boron enhances copper's strength via solid solution-strengthening as an interstitial element.http://www.sciencedirect.com/science/article/pii/S2238785425013444Mass concentration modelOxygen-free copperMechanical propertyElectrical conductivity |
| spellingShingle | Chu Cheng Yan-Shuo Feng Ming-Yu Li Hai-Tao Liu Meng-Xin Wang Ling-Liang Zhang Tao Huang Xiao-Wen Peng Zhi-He Dou Hui-Wen Guo Ke-Xing Song Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties Journal of Materials Research and Technology Mass concentration model Oxygen-free copper Mechanical property Electrical conductivity |
| title | Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties |
| title_full | Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties |
| title_fullStr | Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties |
| title_full_unstemmed | Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties |
| title_short | Deoxidation behavior of boron in the production of C10200 oxygen-free copper: Effects on microstructure and material properties |
| title_sort | deoxidation behavior of boron in the production of c10200 oxygen free copper effects on microstructure and material properties |
| topic | Mass concentration model Oxygen-free copper Mechanical property Electrical conductivity |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425013444 |
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