20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates
Modern power devices face harsh conditions in automotive applications due to high current densities during overload pulses, leading to temperature spikes of up to 300°C at ultra-fast heating rates of up to 106 K/s. This study investigated thermal stresses in 20 µm thick Cu films on Si(100) substrate...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S026412752500084X |
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