Electrochemical deposition of tin-copper alloy coatings
Solderable tin-base alloy coatings are widely used when assembling electronic products. The reorientation of production to lead-free technologies sets the task of developing new technological processes for the formation of coatings for electrical contacts with stable electrical properties, high sold...
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| Main Authors: | D. Y. Gulpa, I. I. Kuzmar, L. K. Kushner, N. V. Dezhkunov, A. A. Khmyl |
|---|---|
| Format: | Article |
| Language: | Russian |
| Published: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2021-11-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/3207 |
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