Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding

Due to the high hardness and brittleness of sapphire, traditional machining methods are prone to surface scratches and microcracks. As an advanced processing technique, ultrasonic machining can reduce damage to hard–brittle materials and improve surface quality. In this study, an integrated ultrason...

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Main Authors: Weiqing Huang, Kaijie Huang, Qunyou Zhong, Jialun Wu, Dawei An
Format: Article
Language:English
Published: MDPI AG 2025-03-01
Series:Micromachines
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Online Access:https://www.mdpi.com/2072-666X/16/4/408
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author Weiqing Huang
Kaijie Huang
Qunyou Zhong
Jialun Wu
Dawei An
author_facet Weiqing Huang
Kaijie Huang
Qunyou Zhong
Jialun Wu
Dawei An
author_sort Weiqing Huang
collection DOAJ
description Due to the high hardness and brittleness of sapphire, traditional machining methods are prone to surface scratches and microcracks. As an advanced processing technique, ultrasonic machining can reduce damage to hard–brittle materials and improve surface quality. In this study, an integrated ultrasonic longitudinal–torsional vibration system consisting of both a horn and a tool was designed. The resonant frequency and output amplitude of the horn were simulated and tested. The results indicated that the resonant frequency was 19.857 kHz, the longitudinal amplitude at the tool end was 4.2 µm, and the torsional amplitude was 1.8 µm. Experiments were then carried out to investigate the effects of various machining parameters on the reduction of sapphire surface roughness (Ra) and material removal rate (MRR). A comparative experiment was then conducted to evaluate the effects of ultrasonic longitudinal and longitudinal–torsional vibration on sapphire grinding. The ultrasonic longitudinal–torsional grinding experiments showed that the surface roughness of the sapphire workpiece was reduced from 960.6 nm to 82.6 nm, and the surface flatness was improved to 84.3 nm. Compared with longitudinal ultrasonic vibration, longitudinal torsional grinding reduced the surface roughness of sapphire workpieces by 48% and increased the surface flatness by 88.3%. The results of this study provide specific guidance for the longitudinal–torsional composite ultrasonic machining of hard–brittle materials.
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spelling doaj-art-c63f62e730754729aefec2a33402bcf72025-08-20T02:28:32ZengMDPI AGMicromachines2072-666X2025-03-0116440810.3390/mi16040408Design of Piezoelectric Ultrasonic Composite Vibration System for Precision GrindingWeiqing Huang0Kaijie Huang1Qunyou Zhong2Jialun Wu3Dawei An4School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, ChinaSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, ChinaSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, ChinaSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, ChinaSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, ChinaDue to the high hardness and brittleness of sapphire, traditional machining methods are prone to surface scratches and microcracks. As an advanced processing technique, ultrasonic machining can reduce damage to hard–brittle materials and improve surface quality. In this study, an integrated ultrasonic longitudinal–torsional vibration system consisting of both a horn and a tool was designed. The resonant frequency and output amplitude of the horn were simulated and tested. The results indicated that the resonant frequency was 19.857 kHz, the longitudinal amplitude at the tool end was 4.2 µm, and the torsional amplitude was 1.8 µm. Experiments were then carried out to investigate the effects of various machining parameters on the reduction of sapphire surface roughness (Ra) and material removal rate (MRR). A comparative experiment was then conducted to evaluate the effects of ultrasonic longitudinal and longitudinal–torsional vibration on sapphire grinding. The ultrasonic longitudinal–torsional grinding experiments showed that the surface roughness of the sapphire workpiece was reduced from 960.6 nm to 82.6 nm, and the surface flatness was improved to 84.3 nm. Compared with longitudinal ultrasonic vibration, longitudinal torsional grinding reduced the surface roughness of sapphire workpieces by 48% and increased the surface flatness by 88.3%. The results of this study provide specific guidance for the longitudinal–torsional composite ultrasonic machining of hard–brittle materials.https://www.mdpi.com/2072-666X/16/4/408ultrasonic grindinglongitudinal–torsional vibrationsapphire wafer grindingresonance frequencysurface morphology
spellingShingle Weiqing Huang
Kaijie Huang
Qunyou Zhong
Jialun Wu
Dawei An
Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding
Micromachines
ultrasonic grinding
longitudinal–torsional vibration
sapphire wafer grinding
resonance frequency
surface morphology
title Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding
title_full Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding
title_fullStr Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding
title_full_unstemmed Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding
title_short Design of Piezoelectric Ultrasonic Composite Vibration System for Precision Grinding
title_sort design of piezoelectric ultrasonic composite vibration system for precision grinding
topic ultrasonic grinding
longitudinal–torsional vibration
sapphire wafer grinding
resonance frequency
surface morphology
url https://www.mdpi.com/2072-666X/16/4/408
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AT qunyouzhong designofpiezoelectricultrasoniccompositevibrationsystemforprecisiongrinding
AT jialunwu designofpiezoelectricultrasoniccompositevibrationsystemforprecisiongrinding
AT daweian designofpiezoelectricultrasoniccompositevibrationsystemforprecisiongrinding