Prediction of delamination strength at interface between thin film and substrate by cohesive zone model
An electronic device consists of multi-layered submicron-thick films, and delamination often takes place at an interface edge because of the stress singularity near the edge. Since the stress singularity at an interface edge depends on the edge shape, the fracture mechanics concept cannot be used to...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Publishing House for Science and Technology
2006-12-01
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| Series: | Vietnam Journal of Mechanics |
| Online Access: | https://vjs.ac.vn/index.php/vjmech/article/view/5585 |
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| _version_ | 1850204641004879872 |
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| author | Do Van Truong Hiroyuku Hirakata Takayuki Katamura |
| author_facet | Do Van Truong Hiroyuku Hirakata Takayuki Katamura |
| author_sort | Do Van Truong |
| collection | DOAJ |
| description | An electronic device consists of multi-layered submicron-thick films, and delamination often takes place at an interface edge because of the stress singularity near the edge. Since the stress singularity at an interface edge depends on the edge shape, the fracture mechanics concept cannot be used to compare the delamination strength between the components with different shapes. This paper aims to predict the delamination strength at the interface edge with arbitrary shape using a cohesive zone model. Two different experiments are conducted for a gold thin film on a silicon substrate to calibrate the cohesive law. The validity of the approach is then discussed. |
| format | Article |
| id | doaj-art-c38d0b76a6f04bf4b8b2967c45ec58c1 |
| institution | OA Journals |
| issn | 0866-7136 2815-5882 |
| language | English |
| publishDate | 2006-12-01 |
| publisher | Publishing House for Science and Technology |
| record_format | Article |
| series | Vietnam Journal of Mechanics |
| spelling | doaj-art-c38d0b76a6f04bf4b8b2967c45ec58c12025-08-20T02:11:15ZengPublishing House for Science and TechnologyVietnam Journal of Mechanics0866-71362815-58822006-12-0128410.15625/0866-7136/28/4/5585Prediction of delamination strength at interface between thin film and substrate by cohesive zone modelDo Van Truong0Hiroyuku Hirakata1Takayuki Katamura2Department of Design of Machinery & Robot, Hanoi University of Technology, VietnamDepartment of Engineering Physics and Mechanics, Kyoto University, JapanDepartment of Engineering Physics and Mechanics, Kyoto University, JapanAn electronic device consists of multi-layered submicron-thick films, and delamination often takes place at an interface edge because of the stress singularity near the edge. Since the stress singularity at an interface edge depends on the edge shape, the fracture mechanics concept cannot be used to compare the delamination strength between the components with different shapes. This paper aims to predict the delamination strength at the interface edge with arbitrary shape using a cohesive zone model. Two different experiments are conducted for a gold thin film on a silicon substrate to calibrate the cohesive law. The validity of the approach is then discussed.https://vjs.ac.vn/index.php/vjmech/article/view/5585 |
| spellingShingle | Do Van Truong Hiroyuku Hirakata Takayuki Katamura Prediction of delamination strength at interface between thin film and substrate by cohesive zone model Vietnam Journal of Mechanics |
| title | Prediction of delamination strength at interface between thin film and substrate by cohesive zone model |
| title_full | Prediction of delamination strength at interface between thin film and substrate by cohesive zone model |
| title_fullStr | Prediction of delamination strength at interface between thin film and substrate by cohesive zone model |
| title_full_unstemmed | Prediction of delamination strength at interface between thin film and substrate by cohesive zone model |
| title_short | Prediction of delamination strength at interface between thin film and substrate by cohesive zone model |
| title_sort | prediction of delamination strength at interface between thin film and substrate by cohesive zone model |
| url | https://vjs.ac.vn/index.php/vjmech/article/view/5585 |
| work_keys_str_mv | AT dovantruong predictionofdelaminationstrengthatinterfacebetweenthinfilmandsubstratebycohesivezonemodel AT hiroyukuhirakata predictionofdelaminationstrengthatinterfacebetweenthinfilmandsubstratebycohesivezonemodel AT takayukikatamura predictionofdelaminationstrengthatinterfacebetweenthinfilmandsubstratebycohesivezonemodel |