Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning

Recent outbreaks and recalls linked to flour-based products have highlighted the need for improved cleaning methods in low-moisture environments. The factors affecting adhesion forces of flour particles, and the vacuum cleaning methodologies to overcome these forces, need to be better understood. Th...

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Main Authors: Ian M. Klug, Bradley P. Marks, Teresa M. Bergholz, Sanghyup Jeong
Format: Article
Language:English
Published: Elsevier 2024-12-01
Series:Journal of Food Protection
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Online Access:http://www.sciencedirect.com/science/article/pii/S0362028X2400156X
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_version_ 1850139244267307008
author Ian M. Klug
Bradley P. Marks
Teresa M. Bergholz
Sanghyup Jeong
author_facet Ian M. Klug
Bradley P. Marks
Teresa M. Bergholz
Sanghyup Jeong
author_sort Ian M. Klug
collection DOAJ
description Recent outbreaks and recalls linked to flour-based products have highlighted the need for improved cleaning methods in low-moisture environments. The factors affecting adhesion forces of flour particles, and the vacuum cleaning methodologies to overcome these forces, need to be better understood. The objectives of this study were to: (1) Measure electrostatic charge build-up in flour under different environmental conditions (20, 40, 60% relative humidity at room temperature), (2) quantify how powder size (US standard No. 60–80 or 80–100 mesh), electrostatic charge (charged and uncharged), and relative humidity impact the force required to remove the powder from an electropolished 304 stainless steel coupon (8 × 8 × 0.2 cm), and (3) determine the most effective vacuum nozzle angle (0, 45, 90° relative to the surface) for cleaning. Chargeability (nC) of flour samples was assessed using Faraday cup electrometry, while the surface adhesion force of the flour particles was measured using a custom-built impact tester. The surface cleanliness after vacuum treatments was assessed using ATP (adenosine triphosphate) swabs and a luminometer. Charged flour samples at 20% relative humidity (RH) exhibited a significantly higher charge compared to those at 40 and 60% RH. Within the 60–80 mesh range, charged flour showed higher adhesion rates than uncharged samples at both 20 and 40% RH. However, in the 80–100 mesh range, charged flour did not show a significant difference in adhesion when compared to uncharged samples at any RH level. Additionally, at 60% RH, surface residues measured by ATP were significantly lower for a vacuum angle of 90° than for 0° across both 60–80 mesh and 80–100 mesh size ranges of wheat flour. The vacuum cleaning treatment proved capable of overcoming the increase in adhesion from triboelectric forces; however, trace flour residues were still detected on stainless steel surfaces postvacuuming, indicating that vacuuming alone may be insufficient.
format Article
id doaj-art-c2f2f8e529b642db9203608249e13d0d
institution OA Journals
issn 0362-028X
language English
publishDate 2024-12-01
publisher Elsevier
record_format Article
series Journal of Food Protection
spelling doaj-art-c2f2f8e529b642db9203608249e13d0d2025-08-20T02:30:23ZengElsevierJournal of Food Protection0362-028X2024-12-01871210037210.1016/j.jfp.2024.100372Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaningIan M. Klug0Bradley P. Marks1Teresa M. Bergholz2Sanghyup Jeong3Department of Biosystems and Agricultural Engineering, Michigan State University, East Lansing, MI, USADepartment of Biosystems and Agricultural Engineering, Michigan State University, East Lansing, MI, USADepartment of Human Nutrition and Food Science, Michigan State University, East Lansing, MI, USADepartment of Biosystems and Agricultural Engineering, Michigan State University, East Lansing, MI, USA; Corresponding author at: 524 S. Shaw Lane 222, Farrall Hall, East Lansing, MI 48824, USA.Recent outbreaks and recalls linked to flour-based products have highlighted the need for improved cleaning methods in low-moisture environments. The factors affecting adhesion forces of flour particles, and the vacuum cleaning methodologies to overcome these forces, need to be better understood. The objectives of this study were to: (1) Measure electrostatic charge build-up in flour under different environmental conditions (20, 40, 60% relative humidity at room temperature), (2) quantify how powder size (US standard No. 60–80 or 80–100 mesh), electrostatic charge (charged and uncharged), and relative humidity impact the force required to remove the powder from an electropolished 304 stainless steel coupon (8 × 8 × 0.2 cm), and (3) determine the most effective vacuum nozzle angle (0, 45, 90° relative to the surface) for cleaning. Chargeability (nC) of flour samples was assessed using Faraday cup electrometry, while the surface adhesion force of the flour particles was measured using a custom-built impact tester. The surface cleanliness after vacuum treatments was assessed using ATP (adenosine triphosphate) swabs and a luminometer. Charged flour samples at 20% relative humidity (RH) exhibited a significantly higher charge compared to those at 40 and 60% RH. Within the 60–80 mesh range, charged flour showed higher adhesion rates than uncharged samples at both 20 and 40% RH. However, in the 80–100 mesh range, charged flour did not show a significant difference in adhesion when compared to uncharged samples at any RH level. Additionally, at 60% RH, surface residues measured by ATP were significantly lower for a vacuum angle of 90° than for 0° across both 60–80 mesh and 80–100 mesh size ranges of wheat flour. The vacuum cleaning treatment proved capable of overcoming the increase in adhesion from triboelectric forces; however, trace flour residues were still detected on stainless steel surfaces postvacuuming, indicating that vacuuming alone may be insufficient.http://www.sciencedirect.com/science/article/pii/S0362028X2400156XCleaningElectrostatic chargeFlourLow-moisture foodPowder adhesionVacuum
spellingShingle Ian M. Klug
Bradley P. Marks
Teresa M. Bergholz
Sanghyup Jeong
Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning
Journal of Food Protection
Cleaning
Electrostatic charge
Flour
Low-moisture food
Powder adhesion
Vacuum
title Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning
title_full Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning
title_fullStr Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning
title_full_unstemmed Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning
title_short Factors Affecting the Adhesion of Flour Particles to Stainless-steel Surfaces and Vacuum Dry-cleaning
title_sort factors affecting the adhesion of flour particles to stainless steel surfaces and vacuum dry cleaning
topic Cleaning
Electrostatic charge
Flour
Low-moisture food
Powder adhesion
Vacuum
url http://www.sciencedirect.com/science/article/pii/S0362028X2400156X
work_keys_str_mv AT ianmklug factorsaffectingtheadhesionofflourparticlestostainlesssteelsurfacesandvacuumdrycleaning
AT bradleypmarks factorsaffectingtheadhesionofflourparticlestostainlesssteelsurfacesandvacuumdrycleaning
AT teresambergholz factorsaffectingtheadhesionofflourparticlestostainlesssteelsurfacesandvacuumdrycleaning
AT sanghyupjeong factorsaffectingtheadhesionofflourparticlestostainlesssteelsurfacesandvacuumdrycleaning