Integrated design of GaN-on-Si power devices and drivers

An all-GaN power chip is designed to meet the application requirements of high-frequency power modules. The chip integrates the driver circuit and 300 V power devices, which effectively reduces the parasitic inductance caused by the discrete package, and the integrated design can improve the chip�...

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Main Authors: Yan Zhangzhe, Zhou Jianjun, Kong Yuechan
Format: Article
Language:zho
Published: National Computer System Engineering Research Institute of China 2025-05-01
Series:Dianzi Jishu Yingyong
Subjects:
Online Access:http://www.chinaaet.com/article/3000171621
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author Yan Zhangzhe
Zhou Jianjun
Kong Yuechan
author_facet Yan Zhangzhe
Zhou Jianjun
Kong Yuechan
author_sort Yan Zhangzhe
collection DOAJ
description An all-GaN power chip is designed to meet the application requirements of high-frequency power modules. The chip integrates the driver circuit and 300 V power devices, which effectively reduces the parasitic inductance caused by the discrete package, and the integrated design can improve the chip's noise immunity and reliability. The chip is prepared in GaN-on-Si process platform and adopts E/D mode IC design. The driver circuit of the chip has an output signal rise time of 4.3 ns and a fall time of 3.4 ns at a switching frequency of 2 MHz, and the power devices are able to work stably at 300 V.
format Article
id doaj-art-c1ce50f1607341ee9d92f7518f4e6e75
institution Kabale University
issn 0258-7998
language zho
publishDate 2025-05-01
publisher National Computer System Engineering Research Institute of China
record_format Article
series Dianzi Jishu Yingyong
spelling doaj-art-c1ce50f1607341ee9d92f7518f4e6e752025-08-20T03:32:40ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982025-05-01515152010.16157/j.issn.0258-7998.2563243000171621Integrated design of GaN-on-Si power devices and driversYan Zhangzhe0Zhou Jianjun1Kong Yuechan2Nanjing Electronic Devices InstituteNanjing Electronic Devices InstituteNanjing Electronic Devices InstituteAn all-GaN power chip is designed to meet the application requirements of high-frequency power modules. The chip integrates the driver circuit and 300 V power devices, which effectively reduces the parasitic inductance caused by the discrete package, and the integrated design can improve the chip's noise immunity and reliability. The chip is prepared in GaN-on-Si process platform and adopts E/D mode IC design. The driver circuit of the chip has an output signal rise time of 4.3 ns and a fall time of 3.4 ns at a switching frequency of 2 MHz, and the power devices are able to work stably at 300 V.http://www.chinaaet.com/article/3000171621ganpower icsingle-channelgan-on-sie/d mode
spellingShingle Yan Zhangzhe
Zhou Jianjun
Kong Yuechan
Integrated design of GaN-on-Si power devices and drivers
Dianzi Jishu Yingyong
gan
power ic
single-channel
gan-on-si
e/d mode
title Integrated design of GaN-on-Si power devices and drivers
title_full Integrated design of GaN-on-Si power devices and drivers
title_fullStr Integrated design of GaN-on-Si power devices and drivers
title_full_unstemmed Integrated design of GaN-on-Si power devices and drivers
title_short Integrated design of GaN-on-Si power devices and drivers
title_sort integrated design of gan on si power devices and drivers
topic gan
power ic
single-channel
gan-on-si
e/d mode
url http://www.chinaaet.com/article/3000171621
work_keys_str_mv AT yanzhangzhe integrateddesignofganonsipowerdevicesanddrivers
AT zhoujianjun integrateddesignofganonsipowerdevicesanddrivers
AT kongyuechan integrateddesignofganonsipowerdevicesanddrivers