Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures
This work provides an overview on the different approaches to make Silicon Hetero-Junction cell (SHJ) production more scalable by investigating alternative metallization processes which can potentially be competitive with the standard Ag-based processes (Ag micro-size). With this purpose, this rese...
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| Format: | Article |
| Language: | English |
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TIB Open Publishing
2025-01-01
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| Series: | SiliconPV Conference Proceedings |
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| Online Access: | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1305 |
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| _version_ | 1841527705940525056 |
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| author | Nicola Frasson Marco Galiazzo |
| author_facet | Nicola Frasson Marco Galiazzo |
| author_sort | Nicola Frasson |
| collection | DOAJ |
| description |
This work provides an overview on the different approaches to make Silicon Hetero-Junction cell (SHJ) production more scalable by investigating alternative metallization processes which can potentially be competitive with the standard Ag-based processes (Ag micro-size). With this purpose, this research aims at introducing the idea of widely using Ag-coated Cu formulations and/or low-Ag deposit solutions involving Ag nanoparticles-based formulations and reactive Ag (also referred as particle free) inks for both rear and front cell depositions on a single (finger and busbars) screen-printing process.
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| format | Article |
| id | doaj-art-c14aed97d83f4cd2acb65b5acc447a35 |
| institution | Kabale University |
| issn | 2940-2123 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | TIB Open Publishing |
| record_format | Article |
| series | SiliconPV Conference Proceedings |
| spelling | doaj-art-c14aed97d83f4cd2acb65b5acc447a352025-01-15T09:50:12ZengTIB Open PublishingSiliconPV Conference Proceedings2940-21232025-01-01210.52825/siliconpv.v2i.1305Pushing Heterojunction Technology Further: Novel Metallization Processes and ArchitecturesNicola Frasson0https://orcid.org/0009-0005-2054-1394Marco Galiazzo1Applied Materials Italia srlApplied Materials Italia srl This work provides an overview on the different approaches to make Silicon Hetero-Junction cell (SHJ) production more scalable by investigating alternative metallization processes which can potentially be competitive with the standard Ag-based processes (Ag micro-size). With this purpose, this research aims at introducing the idea of widely using Ag-coated Cu formulations and/or low-Ag deposit solutions involving Ag nanoparticles-based formulations and reactive Ag (also referred as particle free) inks for both rear and front cell depositions on a single (finger and busbars) screen-printing process. https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1305PhotovoltaicsHeterojunctionSHJAgCuAgCu |
| spellingShingle | Nicola Frasson Marco Galiazzo Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures SiliconPV Conference Proceedings Photovoltaics Heterojunction SHJ Ag Cu AgCu |
| title | Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures |
| title_full | Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures |
| title_fullStr | Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures |
| title_full_unstemmed | Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures |
| title_short | Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures |
| title_sort | pushing heterojunction technology further novel metallization processes and architectures |
| topic | Photovoltaics Heterojunction SHJ Ag Cu AgCu |
| url | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1305 |
| work_keys_str_mv | AT nicolafrasson pushingheterojunctiontechnologyfurthernovelmetallizationprocessesandarchitectures AT marcogaliazzo pushingheterojunctiontechnologyfurthernovelmetallizationprocessesandarchitectures |