TCAD analysis of the high-temperature reverse-bias stress on AlGaN/GaN HEMTs
The long-term reliability of AlGaN/GaN high electron mobility transistors (HEMTs) is a crucial factor in their widespread adoption for high-power and high-frequency applications. Before investigating the device behavior under high-temperature reverse-bias (HTRB) conditions, a fine tuning of the TCAD...
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Main Authors: | Franco Ercolano, Luigi Balestra, Sebastian Krause, Stefano Leone, Isabel Streicher, Patrik Waltereit, Michael Dammann, Susanna Reggiani |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2025-03-01
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Series: | Power Electronic Devices and Components |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370425000057 |
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