Research of Joining Brittle Nonmetallic Materials with an Active Solder
This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite). However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used. At a soldering temperatu...
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| Format: | Article |
| Language: | English |
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Wiley
2014-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2014/729135 |
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| _version_ | 1849684507360231424 |
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| author | Roman Koleňák Michal Prach |
| author_facet | Roman Koleňák Michal Prach |
| author_sort | Roman Koleňák |
| collection | DOAJ |
| description | This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite). However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used. At a soldering temperature of 860°C and 15 min soldering time, the wetting angle on SiO2 ceramics was 30°, on silicon 42°, and on graphite 52°. All these wetting angles are below 90° and are acceptable for soldering. It has been shown that the bond in all joined materials (SiO2, Si, and C) was of a diffusion character. New intermetallic products were formed on the boundary with nonmetal, thus allowing bond formation. The shear strength of SiO2 ceramics attained an average value of 17 MPa. |
| format | Article |
| id | doaj-art-c0be7f541e3848b980d00e11f7df25e4 |
| institution | DOAJ |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2014-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-c0be7f541e3848b980d00e11f7df25e42025-08-20T03:23:26ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422014-01-01201410.1155/2014/729135729135Research of Joining Brittle Nonmetallic Materials with an Active SolderRoman Koleňák0Michal Prach1Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Paulínska 16, 917 24 Trnava, SlovakiaFaculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Paulínska 16, 917 24 Trnava, SlovakiaThis paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite). However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used. At a soldering temperature of 860°C and 15 min soldering time, the wetting angle on SiO2 ceramics was 30°, on silicon 42°, and on graphite 52°. All these wetting angles are below 90° and are acceptable for soldering. It has been shown that the bond in all joined materials (SiO2, Si, and C) was of a diffusion character. New intermetallic products were formed on the boundary with nonmetal, thus allowing bond formation. The shear strength of SiO2 ceramics attained an average value of 17 MPa.http://dx.doi.org/10.1155/2014/729135 |
| spellingShingle | Roman Koleňák Michal Prach Research of Joining Brittle Nonmetallic Materials with an Active Solder Advances in Materials Science and Engineering |
| title | Research of Joining Brittle Nonmetallic Materials with an Active Solder |
| title_full | Research of Joining Brittle Nonmetallic Materials with an Active Solder |
| title_fullStr | Research of Joining Brittle Nonmetallic Materials with an Active Solder |
| title_full_unstemmed | Research of Joining Brittle Nonmetallic Materials with an Active Solder |
| title_short | Research of Joining Brittle Nonmetallic Materials with an Active Solder |
| title_sort | research of joining brittle nonmetallic materials with an active solder |
| url | http://dx.doi.org/10.1155/2014/729135 |
| work_keys_str_mv | AT romankolenak researchofjoiningbrittlenonmetallicmaterialswithanactivesolder AT michalprach researchofjoiningbrittlenonmetallicmaterialswithanactivesolder |