Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions
Bulk Sn-alloy surface spontaneously develop topographical changes at room temperature due to the time-varying shallow grain (SG) transformations, significantly impacting surface roughness and arising surface instability concerns for its industrial applications such as fixed abrasive lapping plates....
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Elsevier
2025-06-01
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| Series: | Materials & Design |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525004915 |
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| author | Bei Hu Wenjun Zhou Kensuke Tsuchiya |
| author_facet | Bei Hu Wenjun Zhou Kensuke Tsuchiya |
| author_sort | Bei Hu |
| collection | DOAJ |
| description | Bulk Sn-alloy surface spontaneously develop topographical changes at room temperature due to the time-varying shallow grain (SG) transformations, significantly impacting surface roughness and arising surface instability concerns for its industrial applications such as fixed abrasive lapping plates. However, the underlying case behind SG formation under different internal stress conditions is less investigated especially in bulk alloys, limiting surface quality control during manufacturing. This work focuses on the internal residual stress induced SG transformations and its resultant surface and microstructural features. Two distinct internal stress conditions were fabricated with industrial standard casting and forging respectively, to create varied subsurface stress fields for elucidating SGs’ behavior. Results reveal that SG formation is highly affected and facilitated by stress distribution via active recrystallization near grain boundaries, resulting in new grain boundaries and dynamic crystallographic reorientations. Cast Sn-1 wt% Bi samples exhibited a more pronounced stress gradient near surface, resulting in a rapid increase in surface peak height around SGs, which conversely credits forging as a better method in suppressing the unwanted surface topographic variation. This work summarizes the fundamental understanding of SG behavior under varying internal stress conditions, elevating the function-oriented manufacturing process design on bulk Sn-alloy for ensuring the surface quality. |
| format | Article |
| id | doaj-art-bf656c77a8d942b7b9d8f975d85dd122 |
| institution | DOAJ |
| issn | 0264-1275 |
| language | English |
| publishDate | 2025-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj-art-bf656c77a8d942b7b9d8f975d85dd1222025-08-20T03:11:26ZengElsevierMaterials & Design0264-12752025-06-0125411407110.1016/j.matdes.2025.114071Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditionsBei Hu0Wenjun Zhou1Kensuke Tsuchiya2Corresponding author.; Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, JapanInstitute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, JapanInstitute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, JapanBulk Sn-alloy surface spontaneously develop topographical changes at room temperature due to the time-varying shallow grain (SG) transformations, significantly impacting surface roughness and arising surface instability concerns for its industrial applications such as fixed abrasive lapping plates. However, the underlying case behind SG formation under different internal stress conditions is less investigated especially in bulk alloys, limiting surface quality control during manufacturing. This work focuses on the internal residual stress induced SG transformations and its resultant surface and microstructural features. Two distinct internal stress conditions were fabricated with industrial standard casting and forging respectively, to create varied subsurface stress fields for elucidating SGs’ behavior. Results reveal that SG formation is highly affected and facilitated by stress distribution via active recrystallization near grain boundaries, resulting in new grain boundaries and dynamic crystallographic reorientations. Cast Sn-1 wt% Bi samples exhibited a more pronounced stress gradient near surface, resulting in a rapid increase in surface peak height around SGs, which conversely credits forging as a better method in suppressing the unwanted surface topographic variation. This work summarizes the fundamental understanding of SG behavior under varying internal stress conditions, elevating the function-oriented manufacturing process design on bulk Sn-alloy for ensuring the surface quality.http://www.sciencedirect.com/science/article/pii/S0264127525004915Sn alloySurface topographic instabilityShallow grainMicrostructure evolutionResidual stress |
| spellingShingle | Bei Hu Wenjun Zhou Kensuke Tsuchiya Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions Materials & Design Sn alloy Surface topographic instability Shallow grain Microstructure evolution Residual stress |
| title | Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions |
| title_full | Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions |
| title_fullStr | Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions |
| title_full_unstemmed | Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions |
| title_short | Study on shallow grain induced micro-region surface topography instability of bulk Sn alloys upon internal stress conditions |
| title_sort | study on shallow grain induced micro region surface topography instability of bulk sn alloys upon internal stress conditions |
| topic | Sn alloy Surface topographic instability Shallow grain Microstructure evolution Residual stress |
| url | http://www.sciencedirect.com/science/article/pii/S0264127525004915 |
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