Study of the Package Degradation of IGBT Module during Thermal Cycling Test

Study of the Package Degradation of IGBT Module during Thermal Cycling Test

Failure mechanisms of IGBT module are complex, one of which is package degradation. To eliminate the interference of application condition and other effects, the correlation between module failure and package degradation was built via severe thermal cycling test. Results show that the degradation wi...

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Bibliographic Details
Main Authors: XU Ninghua, PENG Yongdian, LUO Haihui, FENG Huiyu, LI Liangxing, LI Han
Format: Article
Language:zho
Published: Editorial Office of Control and Information Technology 2016-01-01
Series:Kongzhi Yu Xinxi Jishu
Subjects:
failure analysis
thermal cycling capability
package degradation
reliability
Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.04.005
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