Study of the Package Degradation of IGBT Module during Thermal Cycling Test
Failure mechanisms of IGBT module are complex, one of which is package degradation. To eliminate the interference of application condition and other effects, the correlation between module failure and package degradation was built via severe thermal cycling test. Results show that the degradation wi...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2016-01-01
|
| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.04.005 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849224755941474304 |
|---|---|
| author | XU Ninghua PENG Yongdian LUO Haihui FENG Huiyu LI Liangxing LI Han |
| author_facet | XU Ninghua PENG Yongdian LUO Haihui FENG Huiyu LI Liangxing LI Han |
| author_sort | XU Ninghua |
| collection | DOAJ |
| description | Failure mechanisms of IGBT module are complex, one of which is package degradation. To eliminate the interference of application condition and other effects, the correlation between module failure and package degradation was built via severe thermal cycling test. Results show that the degradation will be encountered after packaging, such as solder layer delamination, loose busbars and lift-off bonding wires, which may cause module failure. Principle of material selection and structure design was get by studying the theory of material mechanics. The influence of packaging process was discussed and the optimized methods were proposed aiming to solder layer and bow of baseplate, IMC, terminal soldering, wire bonding, etc. |
| format | Article |
| id | doaj-art-bedb62bcde4f478095ac2c11126f7ecb |
| institution | Kabale University |
| issn | 2096-5427 |
| language | zho |
| publishDate | 2016-01-01 |
| publisher | Editorial Office of Control and Information Technology |
| record_format | Article |
| series | Kongzhi Yu Xinxi Jishu |
| spelling | doaj-art-bedb62bcde4f478095ac2c11126f7ecb2025-08-25T06:56:01ZzhoEditorial Office of Control and Information TechnologyKongzhi Yu Xinxi Jishu2096-54272016-01-0133232982336304Study of the Package Degradation of IGBT Module during Thermal Cycling TestXU NinghuaPENG YongdianLUO HaihuiFENG HuiyuLI LiangxingLI HanFailure mechanisms of IGBT module are complex, one of which is package degradation. To eliminate the interference of application condition and other effects, the correlation between module failure and package degradation was built via severe thermal cycling test. Results show that the degradation will be encountered after packaging, such as solder layer delamination, loose busbars and lift-off bonding wires, which may cause module failure. Principle of material selection and structure design was get by studying the theory of material mechanics. The influence of packaging process was discussed and the optimized methods were proposed aiming to solder layer and bow of baseplate, IMC, terminal soldering, wire bonding, etc.http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.04.005failure analysisthermal cycling capabilitypackage degradationreliability |
| spellingShingle | XU Ninghua PENG Yongdian LUO Haihui FENG Huiyu LI Liangxing LI Han Study of the Package Degradation of IGBT Module during Thermal Cycling Test Kongzhi Yu Xinxi Jishu failure analysis thermal cycling capability package degradation reliability |
| title | Study of the Package Degradation of IGBT Module during Thermal Cycling Test |
| title_full | Study of the Package Degradation of IGBT Module during Thermal Cycling Test |
| title_fullStr | Study of the Package Degradation of IGBT Module during Thermal Cycling Test |
| title_full_unstemmed | Study of the Package Degradation of IGBT Module during Thermal Cycling Test |
| title_short | Study of the Package Degradation of IGBT Module during Thermal Cycling Test |
| title_sort | study of the package degradation of igbt module during thermal cycling test |
| topic | failure analysis thermal cycling capability package degradation reliability |
| url | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.04.005 |
| work_keys_str_mv | AT xuninghua studyofthepackagedegradationofigbtmoduleduringthermalcyclingtest AT pengyongdian studyofthepackagedegradationofigbtmoduleduringthermalcyclingtest AT luohaihui studyofthepackagedegradationofigbtmoduleduringthermalcyclingtest AT fenghuiyu studyofthepackagedegradationofigbtmoduleduringthermalcyclingtest AT liliangxing studyofthepackagedegradationofigbtmoduleduringthermalcyclingtest AT lihan studyofthepackagedegradationofigbtmoduleduringthermalcyclingtest |